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 1. Tech Industry


HUAWEI PATENT REVEALS 3NM-CLASS PROCESS TECHNOLOGY PLANS — CHINA CONTINUES TO
MOVE FORWARD DESPITE US SANCTIONS

News
By Anton Shilov
published May 28, 2024

Huawei and SMIC could produce 3nm chips using DUV tools and multi patterning.





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Comments (20)

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(Image credit: Shutterstock)


When Huawei and Semiconductor Manufacturing International Co. (SMIC)
patented self-aligned quadruple patterning (SAQP) lithography methods to produce
advanced microchips earlier this year, most assumed the companies were working
on building chips using their 5nm-class fabrication process. Apparently, that's
not the limit of their plans, as Huawei is now looking forward to
using quadruple patterning for 3nm-class manufacturing technology as well.

SiCarrier, a state-backed chip manufacturing equipment developer that's working
with Huawei, also patented a multi-patterning technique, confirming SMIC's plans
to use this technology for future nodes. Experts like Dan Hutcheson
from TechInsights suggest that while SAQP may allow China to manufacture
5nm-class chips, EUV machines will be essential for long-term competitiveness
beyond these nodes. Industry experts never envisioned the use of quadruple
patterning for 3nm-class nodes.

7nm-class process technology features 36nm–38nm metal pitches, while 5nm-class
nodes shrink the metal pitches to 30nm–32nm. At 3nm, metal pitches will get to
approximately 21nm–24nm. That could achieve critical dimensions of approximately
12nm for high-volume manufacturing, something that even Low-NA EUV tools cannot
achieve without using of double patterning. Yet it looks like Huawei and SMIC
plan to get there with SAQP using DUV tools.

SAQP is crucial for Huawei and SMIC as they lack access to leading-edge
lithography tools like ASML's Twinscan NXT:2100i and Twinscan
NXE:3400C/3600D/3800E. That's due to export rules imposed by the Nerherlands,
with the U.S. being the primary instigator of the restrictions. SAQP involves
repeatedly etching lines on silicon wafers to increase transistor density,
reduce power consumption, and enhance performance. This approach mirrors Intel's
previous attempts to avoid relying on extreme ultraviolet (EUV) lithography
machines in 2019–2021 with its 10nm-class (later renamed "Intel 7") node.

Despite the potential benefits, SAQP's use presents difficult challenges.
Intel's first-generation 10nm-class process technology failed at least in part
due to this method. Yields were rumored to be so bad that the only 10nm Canon
Lake CPU only had two CPU cores and the integrated graphics was disabled.
However, for SMIC, SAQP is necessary to progress in semiconductor technology,
enabling the production of more sophisticated chips — including next-generation
HiSilicon Kirin processors for consumer devices and Ascend processors for AI
servers.

Although the cost per 5nm or 3nm chip using SAQP will almost certainly be
higher, making it less feasible (if at all) for commercial devices, the method
remains vital for China's advancements in semiconductor technology. These
advancements are essential not only for consumer electronics but also for
applications like supercomputers and potentially for developing military
capability.




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Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of
decades, he has covered everything from CPUs and GPUs to supercomputers and from
modern process technologies and latest fab tools to high-tech industry trends.




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20 Comments Comment from the forums
 * usertests
   Do the 7/5 nodes compare well to TSMC/Samsung/Intel on transistor density,
   efficiency, etc.? Could be innovation in naming.
   Reply
 * That's a very OLD patent application link though. No 3nm info as well.
   Reply
 * ThomasKinsley
   Make it first. Make it cheaper second. The thing is China doesn't even need
   to be profitable in the high tech sector for a long time. Profits from
   mass-produced lower-tier chips will cover the costs, and any remainder that
   is left will be more than helped by state subsidies. The only thing that
   sanctions can reasonably do is force China to overcome technical hurdles on
   their own, but that isn't hard since China poached industry leaders long ago.
   Reply
 * EyadSoftwareEngineer
   I'm laughing so much now on US sanctions on China, now China reached nod even
   smaller than TSMC!.
   It has been said many times that if you want to lose an industry to China,
   just try to restrict it in China.
   Reply
 * peachpuff
   > EyadSoftwareEngineer said:
   > I'm laughing so much now on US sanctions on China, now China reached nod
   > even smaller than TSMC!.
   
   Does it count if its only on paper?
   Reply
 * ThomasKinsley
   > peachpuff said:
   > Does it count if its only on paper?
   
   A good question for Intel. ;)
   Reply
 * _Shatta_AD_
   > peachpuff said:
   > Does it count if its only on paper?
   
   Regardless whether this is only on paper or even real. Statistically
   speaking, if there’s one country in this world that could overcome hurdles
   and not take restrictions sitting down would be China. I don’t even need to
   list examples, cause there’s just too many. Look no further than their space
   program. It’s just a matter of time. US sanctions can only delay the
   inevitable if not actually sped it up.
   Reply
 * TJ Hooker
   The patent linked doesn't seem to mention anything about 3nm (or any other
   specific nodes) and, as pointed out above, is several years old. So where
   exactly is this article's claim about this technique is going to be used for
   3nm coming from?
   Reply
 * TJ Hooker
   > EyadSoftwareEngineer said:
   > now China reached nod even smaller than TSMC!.
   
   TSMC achieved volume manufacturing of their N3 node over a year ago. There is
   no evidence that any Chinese fabs are currently capable of 3nm. How exactly
   have they "reached nod (sic) even smaller than TSMC"?
   Reply
 * Yes exactly. There is no mention of 3nm in the linked patent as well, as it
   is an old application !
   Reply
 * View All 20 Comments

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