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THE COMMUNICATION CONNECTION: TIME SENSITIVE NETWORKING, SOSA AND THE ETHERNET
REVOLUTION

by Amelia Dalton - June 14, 2024

This week my podcast guest is longtime friend of the show Nigel Forrester from
Concurrent Technologies! Nigel and I chat about time sensitive networking, how
TSN profiles are grouped, what kind of standards are being developed to support
these profiles, and how ethernet will pave the way for innovation in real-time
communications in the future. Also this week, I check out how you can fly your …
Read More → "The Communication Connection: Time Sensitive Networking, SOSA and
the Ethernet Revolution"


BOTA SYSTEMS GIVES ROBOTS THE SENSE OF TOUCH

by Max Maxfield - June 13, 2024

Let’s commence this column by performing a simple thought experiment. Suppose I
were to give you a bolt and associated nut and tell you to hold one in each
hand. Now suppose I were to tell you to screw the nut onto the bolt. In this
case, your primary sensory apparatus would be your eyes, but other sensory
modalities would also come into play.</ … Read More → "Bota Systems Gives Robots
the Sense of Touch"


THE FIRST ICS ON THE MOON – THE APOLLO GUIDANCE COMPUTER, PART 2

by Steven Leibson - June 12, 2024

Part 1 of this article discussed the Fairchild resistor-transistor logic (RTL)
NOR gate ICs used in the Apollo Guidance Computer (AGC) for NASA’s manned lunar
program in the 1960s. Ultimately, NASA ordered one million ICs – so many that
Fairchild alone was not able to fulfill the orders, so NASA ordered parts from
Motorola Semiconductor, Philco, Texas Instruments, Transitron, and Westinghouse.
The AGC Block I computers used Fairchild’ … Read More → "The First ICs on the
Moon – The Apollo Guidance Computer, Part 2"


CEVA-WAVES LINKS MULTI-PROTOCOL WIRELESS CONNECTIVITY IP

by Max Maxfield - June 11, 2024

I’m afraid that (what I laughingly refer to as) my mind is wandering (as is its
wont). It knows it’s supposed to write about multi-protocol wireless IP, but
it’s been beguiled by thoughts of headphones equipped with the latest and
greatest in 3D spatial audio boasting state-of-the-art headtracking resulting in
a new level of immersive experience.

What … Read More → "Ceva-Waves Links Multi-Protocol Wireless Connectivity IP"


THE FIRST ICS ON THE MOON – THE APOLLO GUIDANCE COMPUTER, PART 1

by Steven Leibson - June 10, 2024

In a speech made at Rice University on May 25, 1961, twenty days after Alan
Shepard became the first American astronaut to fly into space in the Freedom 7
Mercury space capsule, U.S. President John F Kennedy said:

“Now it is time to take longer strides – time for a great new American
enterprise – time for this nation to take a clearly leading role in space … Read
More → "The First ICs on the Moon – The Apollo Guidance Computer, Part 1"


A SEA CHANGE IN ANALOG RF ARCHITECTURES: THE FUTURE ACCORDING TO DIRECT RF

by Amelia Dalton - June 7, 2024

What do Direct RF, next generation signal processing, and the acoustic wonder of
spider webs have in common? This here podcast! Noah Donaldson (CTO – Annapolis
Micro Systems) joins me this week to chat about why Direct RF is a game changer
for signal acquisition and processing. We also discuss the challenges inherent
with Direct RF, the biggest benefits of this technology, and where Noah sees
Direct RF headed in … Read More → "A Sea Change in Analog RF Architectures: The
Future According to Direct RF"

Articles Archive →
industry news
June 14, 2024
Mouser Electronics Offers Wide Selection of Products from Schneider Electric
Knowles and Audiodo Collaborate to Empower Personalized, Immersive Listening
with TWS Earbuds
New Elma CMFF SAVE-compliant Chassis for Ground Combat and Tactical Vehicles
Aligned to SOSA™ and CMOSS
Newark and Würth Elektronik collaborate to boost IoT connectivity through RF
excellence
June 13, 2024
AdaCore supports the Safety-Critical Rust Consortium
Collaboration between On and Verity – two pioneering Swiss brands – to transform
supply chain operations with AI and robotics
Microelectronics Industry Education & Workforce Challenges Explored at the 2024
IEEE Electronic Components and Technology Conference (ECTC)
Curtiss-Wright Expands Axon Airborne Data Acquisition Product Family with
Miniature 8-Channel ADC DAU that Supports PoE and Daisy-Chain Connectivity
Shelly X module revolutionizes the IoT industry by offering tailor-made
zero-code solution
Curtiss-Wright to Showcase Flight Test and Monitoring Solutions at the ETTC 2024
– European Test and Telemetry Conference
Power Integrations Revs Up Motor-Drive Offering With BridgeSwitch-2 BLDC IC
Family
Intel’s New SoC Solution Accelerates Electric Vehicle Innovation, Slashing Costs
ROHM’s New TRCDRIVE pack™ with 2-in-1 SiC Molded Module: Significantly Reduces
the Size of Electric Vehicle Inverters
SEGGER introduces Device Provisioner for target device configuration
Infineon introduces Power System Reliability Modeling to reduce power shortages
and blackouts in data center systems
Qorvo® Revolutionizes Circuit Breakers with 750V 4 milliohm SiC JFET in TOLL
Package
Henkel launches two novel additional solutions in its IIoT Loctite Pulse
portfolio
HFA3500TF: The Ultimate Low-Profile Power Supply for Industrial Applications
New OptiMOS™ 7 MOSFETs improve on-state resistance, design robustness and
switching efficiency in automotive applications
STMicroelectronics launches STeID Java Card™ solutions for trusted e-Identity
and e-Government applications
June 12, 2024
Point One Navigation’s New Tags feature Makes Fleet-Level Positioning Simple for
Device and System Developers
Nexperia’s portfolio of 650 V SiC diodes now addresses automotive and a wider
range of industrial applications
ITTIA Announces Compatibility with Elektrobit Products in Drive Towards
Software-Defined Mobility
PCIM 2024: SemiQ Introduces 1700V SiC Schottky Discretes and Dual Diode Modules
NOVOSENSE Introduces 16/24-Channel Automotive LED Driver at PCIM Europe 2024
Pasternack’s New High-Performance RF Angled PCB Connectors Come in Several Sizes
June 11, 2024
Pixus Announces a Mini Cube Test Chassis for SOSA Aligned & OpenVPX
New Incremental Encoder Supports Smaller Shaft Sizes from 1 to 6.35 mm
Arteris Selected by Esperanto Technologies to Integrate RISC-V Processors for
High-Performance AI and Machine Learning Solutions
Avnet Launches K24 I/O Development Kit for Design Engineers Seeking a Rapid
Start with the AMD Kria K24 SOM
Microchip Makes it Easier to Design an On-Board Charger Solution
Synopsys Accelerates Trillion Parameter HPC & AI Supercomputing Chip Designs
with Industry’s First PCIe 7.0 IP Solution
TE Connectivity launches Standard and Miniature Adhesive Saddle Brackets for
faster and more efficient cable management
June 10, 2024
GlobalPlatform unveils initiatives to scale support for SESIP IoT security
evaluation standard
Infineon introduces new 600 V CoolMOS™ S7TA MOSFETs featuring integrated
high-precision temperature sensor
June 7, 2024
Softing Industrial introduces edgeConnector for the integration of Allen-Bradley
controllers into industrial edge applications
u-blox launches comprehensive Bluetooth Angle-of-Arrival solution to enable
reliable indoor asset tracking
NXP and ZF Collaborate on SiC-Based Traction Inverters to Boost Electric Vehicle
Powertrains
Keysight and Ericsson to Demonstrate Pre-6G Network at IEEE International
Conference on Communications 2024
Infineon presents new 600 V CoolMOS™ 8 SJ MOSFET family for advanced and
cost-effective power supply applications
ROHM’s New Shunt Resistors Contribute to Greater Miniaturization in Automotive,
Consumer, and Industrial Equipment Applications
Sigasi Redefines Chip Design Creation, Integration, Validation Leveraging
Shift-Left Principles
DigiKey to Exhibit and Giveaway Multiple XRP Open-Robotics Platforms at Open
Sauce 2024
MYIR Introduces New SOM Featuring Xilinx Artix-7 XC7A100T FPGA
June 6, 2024
McObject LLC Joins STMicroelectronics Partner Program to Expand, Enhance and
Accelerate Customer Time-to-Market.
News Archive →


FEATURED CHALK TALK

FleClear: TDK’s Transparent Conductive Ag Film
Sponsored by Mouser Electronics and TDK
In this episode of Chalk Talk, Amelia Dalton and Chris Burket from TDK
investigate the what, where, and how of TDK’s transparent conductive Ag film
called FleClear. They examine the benefits that FleClear brings to the table
when it comes to transparency, surface resistance and haze. They also chat about
how FleClear compares to other similar solutions on the market today and how you
can utilize FleClear in your next design.
Click here for more information about TDK FLECLEAR Ag-Stacked Film Sheets
Feb 7, 2024
17,532 views


FEATURED PAPER


NAVIGATING DESIGN CHALLENGES: BLOCK/CHIP DESIGN-STAGE VERIFICATION

Sponsored by Siemens Digital Industries Software

Explore the future of IC design with the Calibre Shift left initiative. In this
paper, author David Abercrombie reveals how Siemens is changing the game for
block/chip design-stage verification by moving Calibre verification and
reliability analysis solutions further left in the design flow, including
directly inside your P&R tool cockpit. Discover how you can reduce traditional
long-loop verification iterations, saving time, improving accuracy, and
dramatically boosting productivity.

Click here to read more


discussion
The First ICs on the Moon – The Apollo Guidance Computer, Part 2
Posted on Jun 14 at 5:54am by jackrubin
Always happy to see you untangling the threads of history. Unfortunately, the
link to Lenore's article is a 404 since the Evil Mad folks decamped to the East
Coast. Can you provide an updated link? Thanks!
Z80, Adieu
Posted on Jun 11 at 8:31am by bpaddock
What really pushed the AVR and the PIC to the forefront of the day was, oddly,
Motorola. Motorola had a lot of design wins with the 6805, then one day said "we
sold them all to Detroit". The AVR and the PIC were the only available near
equivalents then and we ...
A Last Embedded Dance with Jack Ganssle
Posted on Jun 6 at 9:21am by Max Maxfield
Thanks for sharing this Steve -- Jack is one of my heroes -- plus he's a really
nice guy -- I'd not heard the trick about using a 3-bit R-2R ladder DAC to
provide the ID of the currently executing task on an analog meter -- VERY
COOL!!!
A Last Embedded Dance with Jack Ganssle
Posted on Jun 5 at 10:59am by traneusee
The Intel 8251 and 8251A differed in ready-pin response time. I made a design
that required the 8251A. NEC second-sourced both parts, and NEC 8251A's worked
well. Toshiba second-sourced the 8251 but labeled their parts 8251A, causing
problems in purchasing and production. Yes, for us old timers the Permanent
Embed is not ...
A Last Embedded Dance with Jack Ganssle
Posted on Jun 5 at 9:34am by traneusee
I started working on embedded systems in 1973, using Intel and second-source
Microsystems International 8008 processors. From 1980 to 2010, I worked on
hard-real-time math-heavy electromagnetic instrumentation. We coded in assembly
language on the bare metal. In 1998, I used one of the first 24-bit audio A/D
converters driving an Integrated Device Technology 64-bit ...
A Last Embedded Dance with Jack Ganssle
Posted on Jun 5 at 9:29am by M. Simon
How time passes. Brain dead processors? Try a 1 bit processor (Motorola) or the
more common 4 bitters. I designed the IO board that went into the World's First
BBS. Helped Randy and Ward with the dog 8251 serial chip. I never used that one
again. TTL was glue logic back then. Great ...
Are Holographic Displays the Ultimate UI for AI?
Posted on Jun 5 at 6:02am by Max Maxfield
It's getting to be harder and harder to tell the difference LOL
Issuing a Challenge to Edge AI Processor Manufacturers
Posted on Jun 5 at 6:02am by Max Maxfield
Hi there -- thanks for your comment -- I don't do this with all my projects --
but sometimes they are relevant to some new technology. My friend Joe is
re-spinning the PCBs -- my VFD tubes have arrived -- Alif are working on
tweaking their Vision AppKit to give ...
Are Holographic Displays the Ultimate UI for AI?
Posted on Jun 3 at 2:22pm by theboom
Are you bouncing off real walls? Or virtual ones?
IBM Research Fellow Robert H. Dennard, 1932-2024: Inventor of the DRAM,
Formulated MOS Scaling Law
Posted on Jun 3 at 10:42am by Steven Leibson
Atanasoff developed the Atanasoff-Berry Computer (ABC) in the late 1930s and
early 1940s. The machine used a capacitive rotating drum to store data. All of
Atanasoff's work predated development of the transistor in 1947 and of the IC in
1959/1960. You could say that Atanasoff was the first to harness capacitive data
...

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featured blogs
I Want a Display Wall!
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chalk talks
subscribe on YouTube
ROHM’s 3rd Gen 650V IGBT for a Wide range of Applications: RGW and RGWS Series
Sponsored by Mouser Electronics and ROHM Semiconductor
In this episode of Chalk Talk, Amelia Dalton and Heath Ogurisu from ROHM
Semiconductor investigate the benefits of ROHM Semiconductor’s RGW and RGWS
Series of IGBTs. They explore how the soft switching of these hybrid IGBTs
contribute to energy savings and power generation efficiency and why these IGBTs
provide a well-balanced solution for switching and cost.
Click here for more information about ROHM Semiconductor RGW 650V Field Stop
Trench IGBTs
Jun 5, 2024
1,316 views
Easily Connect to AWS Cloud with ExpressLink Over Wi-Fi
Sponsored by Mouser Electronics and AWS and u-blox
In this episode of Chalk Talk, Amelia Dalton, Lucio Di Jasio from AWS and Magnus
Johansson from u-blox explore common pitfalls of designing an IoT device from
scratch, the benefits that AWS IoT ExpressLink brings to IoT device design, and
how the the NORA-W2 AWS IoT ExpressLink multiradio modules can make retrofitting
an already existing design into a smart AWS connected device easier than ever
before.
Click here for more information about u-blox NORA-W2 Expresslink Multiradio
Modules
May 30, 2024
1,980 views
Infineon and Mouser introduction to Reliable Solid State Isolators
Sponsored by Mouser Electronics and Infineon
In this episode of Chalk Talk, Amelia Dalton and Daniel Callen Jr. from Infineon
explore trends in solid state isolator and relay solutions, the benefits that
Infineon’s SSI solutions bring to the table, and how you can get started using
these solutions for your next design. 
Click here for more information about Infineon Technologies Solid State
Isolators (SSIs)
May 28, 2024
2,424 views
Driving Next-Gen Efficiency and Productivity to the Battery Lifecycle
Sponsored by Mouser Electronics and Vicor
In this episode of Chalk Talk, Amelia Dalton and David Krakauer from Vicor
explore the evolution of battery technology and the specific benefits that power
modules bring to battery cell formation, battery testing and battery recycling.
They investigate what sets Vicor power modules apart from other solutions on the
market today and how you take advantage of Vicor power modules in your next
design.
Click here for more information about Vicor Battery Formation & Test
Applications
May 24, 2024
2,907 views
From Sensor to Cloud:A Digi/SparkFun Solution
Sponsored by Mouser Electronics and Digi and SparkFun Electronics
In this episode of Chalk Talk, Amelia Dalton, Mark Grierson from Digi, and Rob
Reynolds from SparkFun Electronics explore how Digi and SparkFun electronics are
working together to make cellular connected IoT design easier than ever before.
They investigate the benefits that the Digi Remote Manager® brings to IoT
design, the details of the SparkFun Digi XBee Development Kit, and how you can
get started using a SparkFun Board for XBee for your next design.
Click here for more information about SparkFun XBee® Development Boards
May 21, 2024
3,389 views
SiC-Based High-Density Industrial Charger Solutions
Sponsored by Mouser Electronics and onsemi
In this episode of Chalk Talk, Amelia Dalton and Prasad Paruchuri from onsemi
explore the benefits of silicon carbide based high density industrial charging
solutions. They investigate the topologies of Totem Pole PFC and Half Bridge LLC
circuits, the challenges that bidirectional CLLC resonant DC-DC converters are
solving today, and how you can take advantage of onsemi’s silicon carbide
charging solutions for your next design.
Click here for more information about onsemi DC Fast EV Charging
May 21, 2024
3,506 views
Chalk Talk Archive →

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