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MORE OPTIONSDISAGREEAGREE
 * Home
 * Sound Recording
 * Engineering
 * Acoustic Engineering
 * microphones

Article


A PIEZORESISTIVE MICROPHONE FOR AEROACOUSTIC MEASUREMENTS

 * January 2001

Authors:
David Arnold
 * University of Florida



S. Gururaj


S. Gururaj
 * This person is not on ResearchGate, or hasn't claimed this research yet.



S. Bhardwaj


S. Bhardwaj
 * This person is not on ResearchGate, or hasn't claimed this research yet.



Toshikazu Nishida
 * University of Florida



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Citations (35)
References (6)





ABSTRACT

This paper presents the characterization of a piezoresistive silicon microphone.
The microphone was designed for aeroacoustic measurements where small size, high
dynamic range, large frequency bandwidth, and low power requirements are
desired. It consists of four dielectrically-isolated, single-crystal silicon
piezoresistors mounted on the top surface of a circular, tensile silicon nitride
diaphragm. Multiple devices were characterized in terms of linearity, frequency
response, drift, noise, and power. The sensors exhibit an average sensitivity of
0.6 μV/PȧV, a flat frequency response, minimal drift, and consume 15 mW of power
when operated at 3 V. They show a linear response up to 750 dB SPL and a 52 dB
SPL noise floor (1 Hz bin centered at 1 kHz).

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CITATIONS (35)


REFERENCES (6)




... There have been many MEMS microphones developed in the past; however, most
of these have focused on audio applications [3]. While there has been limited
development in the area of aeroacoustic microphones, their overall performance
is far from that of the B&K 4138 condenser microphone [4][5][6][7]. Several
previous MEMS microphones have sufficient bandwidth and maximum pressure
[4][5][6]; however, the noise floor of these devices is too high. ...
... While there has been limited development in the area of aeroacoustic
microphones, their overall performance is far from that of the B&K 4138
condenser microphone [4][5][6][7]. Several previous MEMS microphones have
sufficient bandwidth and maximum pressure [4][5][6]; however, the noise floor of
these devices is too high. ...
... With the appropriate packaging, this device has the potential to enable
microphone placement in locations prohibited by the size of the B&K 4138
microphone. Arnold et al. [4] 1.0 mm 160 dB 100 kHz 52 dB 1 Scheeper et al. [5]
3.9 mm 141 dB 20 kHz 23 dBA ...

A SURFACE MICROMACHINED CAPACITIVE MICROPHONE FOR AEROACOUSTIC APPLICATIONS
Conference Paper
Full-text available
 * Jun 2008

 * D.T. Martin
 * Karthik Kadirvel
 * Toshikazu Nishida
 * Mark Sheplak

View
... The goal of this research is to develop a MEMS microphone for aeroacoustic
measurements. The key requirements for aeroacoustic measurements have been
previously discussed in Section 1.1 and are summarized in Table 1 [13], the
piezoelectric microphone developed by Horowitz et al. [14], and the capacitive
microphone developed by Scheeper et al. [15]. However, the benchmark for
aeroacoustic microphones is the conventional (non-MEMS) Brüel and Kjaer 4138
condenser microphone. ...
... Arnold et al. [13], without great concern for the input capacitance of the
amplifier. ...
... There have been several piezoresistive microphone designs that meet one or
more of the requirements for aeroacoustic measurements. The microphone presented
by Arnold et al. [13] is the best piezoresistive microphone for aeroacoustic
measurements to date. It has sufficient bandwidth and dynamic range. ...

DESIGN, FABRICATION, AND CHARACTERIZATION OF A MEMS DUAL-BACKPLATE CAPACITIVE
MICROPHONE
Article

 * David Thomas Martin

View
... Although successful microphones have been developed for each of these
transduction schemes, capacitive microphones typically exhibit higher
sensitivities and lower noise floors compared to the other TABLE I COMPARISON OF
THE PREVIOUS AEROACOUSTIC MEMS MICROPHONES AND THE B&K 4138 TRADITIONAL
CONDENSER MICROPHONE types. In addition, piezoresistive microphones exhibit
temperature drift and reduced performance at high temperatures due to junction
leakage, increased thermodynamic noise, and lower π-coefficients [11]. There are
several piezoelectric materials that can be used in piezoelectric microphones.
...
... The microphone was packaged in a cartridge that is approximately the same
size as a 1/4-in B&K microphone. A piezoresistive microphone has been reported
that operates up to 160 dB, has a bandwidth up to 100 kHz, and has a noise floor
of 52 dB/ √ Hz [11]. A piezoelectric microphone has been presented that has a
linear response up to 169 dB, a noise floor of 48 dB/ √ Hz, and a 50-kHz
bandwidth [16]. ...
... A comparison of these MEMS microphones to the conventional B&K 4138 1/8-in
condenser microphone [23] is given in Table I. The piezoresistive [11] and the
two piezoelectric microphones [16], [26] compare most favorably. Many of the
listed MEMS microphones have significantly higher noise than the 4138. ...

A Micromachined Dual-Backplate Capacitive Microphone for Aeroacoustic
Measurements
Article
Full-text available
 * Jan 2008
 * J MICROELECTROMECH S

 * David T. Martin
 * Jian Liu
 * Karthik Kadirvel
 * Toshikazu Nishida

This paper presents the development of a micro-machined dual-backplate
capacitive microphone for aeroacoustic measurements. The device theory,
fabrication, and characterization are discussed. The microphone is fabricated
using the five-layer planarized-polysilicon SUMMiT V process at Sandia National
Laboratories. The microphone consists of a 0.46-mm-diameter 2.25-mum-thick
circular diaphragm and two circular backplates. The diaphragm is separated from
each backplate by a 2-mum air gap. Experimental characterization of the
microphone shows a sensitivity of 390 muV/Pa. The dynamic range of the
microphone interfaced with a charge amplifier extends from the noise floor of 41
dB/ radicHz up to 164 dB and the resonant frequency is 178 kHz.
View
Show abstract
... This is important because when designing sensors with low minimum detectable
signal, noise level must be considered. We investigate the mechanical and
electrical noise sources in MEMS piezoresistive microphone using two commercial
piezoresistive pressure sensors: Kulite (MIC -093) and Endevco (8510B-1) and two
UF microphones: UF piezoresistive microphone [15, 16] and UF proximity sensor
[17]. CHAPTER 2 NOISE IN PIEZORESISTIVE MEMS MICROPHONES Noise in MEMS sensors
originates from different sources. ...
... The transduction mechanism of the MEMS piezoresistive microphone is based on
converting acoustic energy into electrical energy. When pressure is applied to
the microphone, the diaphragm deflects producing a change in the resistance of
the four piezoresistors configured in a Wheatstone bridge as shown inFigure 2
[16]. Details of the design of this piezoresistive microphone are presented by
Saini [15]. ...
... In this chapter, we measure the noise power spectral densities of four
microphones: UF piezoresistive microphone [15, 16], UF proximity sensor [17], As
expected, the noise figure is lowest for the proximity sensor due to its highest
output impedance of the four microphones investigated. Since the UF ultrasonic
proximity sensor has the highest output resistance and the UF microphone the
lowest output resistance, their noise figures are respectively the lowest and
highest inFigure 4-2. ...

CHARACTERIZATION OF NOISE IN MEMS PIEZORESISTIVE MICROPHONES
Article
Full-text available

 * Robert Dieme

View
... Therefore microphones with a bandwidth of several hundreds of kHz and a
dynamic range covering 40Pa to 4kPa are still needed for aero-acoustic
measurements. Some research works have been done on micro-fabricated
aero-acoustic microphones using different sensing mechanisms, such as
piezoresistive [3,4], capacitive [5,6], piezoelectric [7] and optical [8]. Most
of them have a predicted bandwidth of ~100kHz and none of them were successfully
calibrated in a real acoustic field with frequency higher than 20kHz. ...
... In this paper, a wide-band piezoresistive aero-acoustic microphone is
demonstrated. The sensitivity of the RC-MILC poly-Si piezoresistor gauges is
similar to their single crystalline silicon counterparts [4]. The wide-band
microphone was calibrated by using spark-generated shockwave and a resonance
peak was found at 400kHz as expected. ...

Wide-Band Piezoresistive Microphone for Aero-Acoustic Applications
Conference Paper
 * Oct 2012

 * Zhijian Zhou
 * Man Wong
 * Libor Rufer
 * Sébastien Ollivier

A surface micro-machined microphone employing recrystallized
metal-induced-laterally crystallized (RC-MILC) polycrystalline silicon (Poly-Si)
piezoresistor is developed for aero-acoustic applications. A static sensitivity
of ~0.4μV/V/Pa is measured using a nano-indentation technique and a useful
bandwidth starting from ~100kHz with a resonance peak at ~400kHz has been
obtained using shock waves generated using a the high-voltage electrical spark
discharge.
View
Show abstract
... Moreover, the batch fabrication of silicon devices can lead to lower costs
and smaller sizes since hundreds or thousands of devices can be fabricated
together on a single silicon wafer [2]. A microphone is a transducer that
converts acoustic energy into electrical energy and is widely employed in a
variety of applications such as sound field measurements [3, 4], hearing aids
[5, 6], and noise monitoring [7]. Many transduction schemes, such as
piezoelectric, piezoresistive, capacitive, electrodynamic and optical [8] have
been developed for the microphone. ...

Nonlinear Identification of a Capacitive Dual-Backplate MEMS Microphone
Article
Full-text available
 * Jan 2005

 * Brian P. Mann
 * Jian Liu
 * David T. Martin
 * Karthik Kadirvel

This paper presents the nonlinear system identification of model parameters for
a capacitive dual-backplate MEMS microphone. System parameters of the microphone
are developed by lumped element modeling (LEM) and a governing nonlinear
equation is thereafter obtained with coupled mechanical and electrostatic
nonlinearities. The approximate solution for a general damped second order
system with both quadratic and cubic nonlinearities and a non-zero external step
loading is explored by the multiple time scales method. Then nonlinear finite
element analysis (FEA) is performed to verify the accuracy of the lumped
stiffnesses of the diaphragm. The microphone is characterized and nonlinear
least-squares technique is implemented to identify system parameters from
experimental data. Finally uncertainty analysis is performed. The experimentally
identified natural frequency and nonlinear stiffness parameter fall into their
theoretical ranges for a 95% confidence level respectively.
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... Such microphones would enable new techniques for the measurement of
noisesource characteristics, for example by means of extremely dense microphone
arrays capable of measuring with great accuracy both pressure amplitude and
direction. Such techniques will be crucial for guiding and validating the
development of accurate noise prediction tools and effective suppression
techniques [3,32]. ...

Microphone based on Polyvinylidene Fluoride (PVDF) micro-pillars and patterned
electrodes
Article
 * Jun 2009
 * SENSOR ACTUAT A-PHYS

 * J. Xu
 * Marcelo Dapino
 * Daniel Gallego-Perez
 * Derek J Hansford

This article is focused on the development of an acoustic pressure sensor with
extremely high sensitivity and small footprint. We propose a sensor design
consisting of micron-sized Polyvinylidene Fluoride (PVDF) pillars which generate
a charge when subjected to normal stresses associated with acoustic waves. A
rigid membrane placed between the micro-pillars and the acoustic medium ensures
high mechanical coupling. The electrode covering the micro-pillars is patterned
to decrease the capacitance, and hence increase the sensitivity of the sensor.
The key sensor parameters (diameter and height of the micro-pillars, gap between
pillar edges, and number of pillars) are determined through a constrained
optimization algorithm in which the penalty function is the sensor footprint.
The algorithm incorporates the effects of mechanical and electrical properties
of the sensor and conditioning amplifier. Details of the fabrication process are
described. Nano-indentation tests demonstrate that the PVDF micro-pillar sensor
exhibits piezoelectric responses under an applied voltage or strain, thus
demonstrating the sensor concept.
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... The frequency response results deviate from the expected behaviour
especially at frequencies above approximately 8 kHz, which can be attributed to
limitations of the normal incidence plane wave tube. The upper cutoff frequency
for plane waves to be present in the 22 mm tube, such that λ < 2D, is
approximately 7.7 kHz, so these deviations from the manufacturer's results are
expected [6]. Further investigation into plane wave tube design is required to
have better confidence in the frequency response tests. ...

Design And Preliminary Testing of a MEMS Microphone Phased Array
Conference Paper
Full-text available
 * Jan 2010

 * S Orlando
 * Adam Bale
 * David A. Johnson

View
... It is evident from the literature that only piezoelectric based transduction
in acoustic sensor is best suited for deployment in any of the applications like
for audio applications, hearing aid or in aircraft fuselage array [1], because
of zero bias, high performance, robustness and simplicity. Prior MEMS acoustic
sensor utilizes piezoresistive or capacitive based [2,3] transduction which
requires biasing and adversely affects the system chip size, power consumption
and cost. Also the most of acoustic sensor devised so far are based on
piezoelectric transduction [4][5][6][7][8][9][10]. ...

Design, Modeling and Simulation of Square Diaphragm Based, Piezoelectric (AlN)
MEMS Acoustic Sensor for High SPL Measurements: Proceedings of IWPSD 2017
Chapter
Full-text available
 * Jan 2019

 * Dhairya Singh Arya
 * Sushil Kumar
 * Mahanth Prasad
 * Chandra Charu Tripathi

This paper reports the aluminum nitride (AlN) based piezoelectric MEMS acoustic
sensor for aeroacoustic applications. The acoustic sensor reported, is square
diaphragm based, which is easy to fabricate. Thin film AlN is considered as the
sensing layer to exploit the property of CMOS process compatibility. The
structure dimensions are chosen to have the cut-on, cut-off and resonance
frequency of 20 Hz, 10 kHz and 45 kHz respectively. The sensitivity of the
sensor is 103 and 84 µv/Pa in case of central and outer annular electrode
pattern respectively. Furthermore a generic lumped model of square diaphragm
based acoustic sensor is also reported. The results thus obtained from lumped
model simulation using MULTISIM 13.0 and distributed model simulation using
Comsol-Multiphysics are in good agreement with the experimentally obtained
results, which validates the lumped model of the square diaphragm based acoustic
sensor.
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... However, they tend to suffer from low sensitivities, temperature drift, and
inherent flicker noise. [6] Capacitive microphones typically have high
sensitivity and a low noise floor, but they can be affected by parasitic
capacitance. [7] MEMS-based aeroacoustic microphones have been developed using
each of the above transduction schemes. ...

Compliant Membranes for the Development of a MEMS Dual-Backplate Capacitive
Microphone using the SUMMiT V Fabrication Process
Article

 * David Martin

Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed
Martin Company, for the United States Department of Energy's National Nuclear
Security Administration under Contract DE-AC04-94AL85000. Approved for public
release; further dissemination unlimited.
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... Table 2.4 summarized the specifications of the piezoresistive
acoustic/pressure sensors discussed above. [77] 20.32 cm ± ×N/R N/R N/R N/R
Peake et al. [78] N/R † N/R N/R N/R Schellin et al. [72] 1mm * ×1μm 6 V 4.17 100
Hz -5 kHz Kälvestin et al. [79]- [81] 100μm * ×0.4μm 10 V 0.09 10 Hz -10 kHz
Kälvestin et al. [80] 300μm * ×0.4μm 10 V 0.03 10 Hz -10 kHz Schellin et al.
[75] 1mm * ×1.3μm 8 V 10 50 Hz -10 kHz Sheplak et al. [83] 105μm † ×0.15μm 10 V
0.1 200 Hz -6 kHz Arnold et al. [84] 500μm † ×1.0μm 10 V 0.6 1 kHz -205 kHz
Naguib et al. [85], [86] 510μm * ×0.4μm 10 V 1 1 kHz -5.5 kHz Naguib et al.
[85], [86] 710μm * ×0.4μm 10 V 1 1 kHz -5.5 kHz Huang et al. [87] 710μm *
×0.38μm N/R 1.1 100 Hz -10 kHz Li et al. [89] N/R×1.0μm 5 V 10 100 Hz -8 kHz
Beclin et al. [71] N/R N/R 50 3 Hz -600 Hz * Side length of square diaphragm. †
Radius of circular diaphragm. ...

Design and development of printed acoustic sensor
Thesis
Full-text available
 * Oct 2015

 * Rubaiyet Iftekharul Haque

L’objectif de ce travail était de concevoir et réaliser par impression un
capteur acoustique capacitif résonant bas coût. Il s’inscrit dans le cadre d’un
projet collaboratif de recherche intitulé « Spinnaker », défini par la société
Tagsys RFID qui souhaite intégrer ce capteur afin d’améliorer la géolocalisation
des étiquettes RFID. Ce travail a débuté par la conception et l’optimisation du
design en utilisant la simulation par éléments finis (COMSOL) ainsi que des
plans d’expériences (DOE : Design of Experiment). Cette première étape a permis
de déterminer les paramètres optimaux et démontrer que les performances obtenues
étaient conformes aux spécifications. Nous avons ensuite développé les
différentes briques technologiques nécessaires à la réalisation des prototypes
en utilisant conjointement l’impression 2D par inkjet et l’impression 3D. Nous
avons vérifié la fonctionnalité de ces capteurs à l’aide de mesures électriques
capacitives et acoustiques par vibrométrie laser. Nous avons démontré la
sélectivité en fréquence des capteurs réalisés et comparé les résultats
expérimentaux à ceux obtenus par simulation. Enfin, nous avons enfin exploré la
« voie piezoélectrique » qui nous semble être une alternative intéressante au
principe capacitif. En l’absence d’encre piézoélectrique commerciale imprimable
par jet de matière, nous avons formulé une encre imprimable à base du
co-polymère PVDF-TrFE et démontré le caractère piézoélectrique des couches
imprimées. Les résultats sont prometteurs mais des améliorations doivent encore
être apportées à cette encre et au procédé d’impression avant de pouvoir
fabriquer des premiers prototypes.
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... Thus, MEMS microphone became an important component in our daily
applications, such as smart phones, tablets, automobiles, Virtual Reality and
IoT devices for smart home and smart buildings [1,2]. The transduction method of
MEMS microphone can be sorted into piezoresistive [3,4], optical [5],
piezoelectric [6,7], and capacitive [8][9][10], and due to the advantages of
capacitive transduction such as high sensitivity, lower noise floor and ease of
fabrication and packaging over other types, silicon-based capacitive MEMS
microphones (CMMs) has been mainly used in the commercial microphone products.
...

Breaking the size barrier of capacitive MEMS microphones from critical length
scale
Conference Paper
Full-text available
 * Jun 2017

 * Wenshu Sui
 * Weiguan Zhang
 * Kui Song
 * Yikuen Lee

View
... The conversion effects mainly used are piezoelectricity, piezoresistivity,
electrostatic, and electromagnetic methods. 8, [11][12][13] The electrostatic
transduction is the most common scheme used in silicon microphones because of
its high sensitivity (∼mV/Pa), large bandwidth and low noise level.
Piezoresistive transducers are robust due to their simple structure,
nevertheless they show a low sensitivity and the piezoresistive material can
suffer from thermal degradation due to the Joule heating effect. ...

Sensitivity and Performances Analysis of a Dynamic Pressure Narrow-Band
Electrodynamic Micro-Sensor
Article
Full-text available
 * Mar 2020

 * Mohamed Hadj said
 * Farès Tounsi
 * Laurent A. Francis
 * Libor Rufer

This paper presents analytic and numerical modeling of a MEMS electrodynamic
micro-sensor of dynamic pressure. Two coaxial planar inductors of different
diameters are used in the proposed micro-sensor design. Using finite element
analysis, the diaphragm resonant frequency and dynamic displacements are
evaluated for different diaphragm thicknesses. Then, the total sensitivity is
deduced by coupling different physical domains which contribute in the
micro-sensor operation. A lumped element model is built in order to study the
micro-sensor sensitivity and define the dynamic performance for different
resonant frequencies. This model shows that the best sensitivity, within the
mV/Pa range, is obtained around the resonant frequency in the audible frequency
range, and decreases to the µV/Pa range for ultrasonic frequencies. The obtained
sensitivity curves prove that the undamped inductive micro-sensor can offer high
pressure sensitivity within a narrow frequency bandwidth.
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High Sensitivity Polyvinylidene Fluoride Microphone Based on Area Ratio
Amplification and Minimal Capacitance
Article
 * May 2015
 * IEEE SENS J

 * Jian Xu
 * Leon M. Headings
 * Marcelo Dapino

This paper presents an inexpensive high-sensitivity microphone based on
polyvinylidene fluoride (PVDF) film. High sensitivity is achieved through
pressure amplification created by the area ratio between the rigid surface
exposed to acoustic waves and a crosshair-shaped PVDF film, in combination with
the reduced capacitance created by a similarly shaped top electrode. The
crosshair shape is obtained through simple chemical etching from commercial PVDF
film. Finite-element simulations including static structure analysis, modal
analysis, and harmonic response are performed to design the microphone. Peak
coalescence of the first three adjacent natural frequencies caused by the
structure damping ratio is observed. Static and dynamic stress analyses ensure
that the design meets the mechanical constraints imposed by PVDF. A plane wave
tube experiment and signal conditioning electronics are developed. Measurements
include benchmarking against a commercial microphone and show that the PVDF
microphone exhibits a linear response up to a sound pressure level of 140 dB and
overall fluctuations of less than ±4 dB over the frequency range of 10 to 20 000
Hz. The sensitivity of the microphone alone, without a conditioning circuit, is
measured as $27.8~mu $ V/Pa, which is 3.01 times the sensitivity of commercial
PVDF film operating in 3-3 mode. This sensitivity gain is close to the physical
area ratio of 3.2. We experimentally characterize the directivity of the sensor
and measure a decay of −10.5 dB at ±90° from the microphone’s axis.
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Highly sensitive spintronic strain-gauge sensor based on magnetic tunnel
junction and its application to MEMS microphone
Conference Paper
 * Dec 2018

 * Shiori Kaji
 * Yoshihiko Fuji
 * Yoshihiro Higashi
 * Michiko Hara

View
Surface and bulk micromachined dual back-plate condenser microphone
Conference Paper
 * Jan 2005

 * D.T. Martin
 * R.M. Fox
 * Karthik Kadirvel
 * Mark Sheplak

This paper presents the design, fabrication, and characterization of a dual
back-plate condenser microphone. The microphone was designed for aeroacoustic
applications where a high dynamic range and high bandwidth are key requirements.
It was fabricated using the SUMMiT V process at Sandia National Laboratories.
The microphone has a 2.25 μm thick circular diaphragm with a 230 μm radius and 2
μm gap between each back-plate. The device has demonstrated a sensitivity of 282
μV/Pa, a linear response up to 160 dB, a noise floor of 42 dB/√Hz at 1 kHz in a
1 Hz bin, and a flat frequency response up to 20 kHz; the theoretical bandwidth
exceeds 100 kHz.
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A directional acoustic array using silicon micromachined piezoresistive
microphones
Article
Full-text available
 * Feb 2003
 * J ACOUST SOC AM

 * David Arnold
 * Louis Cattafesta
 * Toshikazu Nishida
 * Mark Sheplak

The need for noise source localization and characterization has driven the
development of advanced sound field measurement techniques using microphone
arrays. Unfortunately, the cost and complexity of these systems currently limit
their widespread use. Directional acoustic arrays are commonly used in wind
tunnel studies of aeroacoustic sources and may consist of hundreds of condenser
microphones. A microelectromechanical system (MEMS)-based directional acoustic
array system is presented to demonstrate key technologies to reduce the cost,
increase the mobility, and improve the data processing efficiency versus
conventional systems. The system uses 16 hybrid-packaged MEMS silicon
piezoresistive microphones that are mounted to a printed circuit board. In
addition, a high-speed signal processing system was employed to generate the
array response in near real time. Dynamic calibrations of the microphone sensor
modules indicate an average sensitivity of 831 microV/Pa with matched magnitude
(+/-0.6 dB) and phase (+/-1 degree) responses between devices. The array system
was characterized in an anechoic chamber using a monopole source as a function
of frequency, sound pressure level, and source location. The performance of the
MEMS-based array is comparable to conventional array systems and also benefits
from significant cost savings.
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AeroMEMS sensor array for high-resolution wall pressure measurements
Article
 * Nov 2006
 * SENSOR ACTUAT A-PHYS

 * Andreas Berns
 * Ulrich Buder
 * E. Obermeier
 * Alfred Leder

The measurement of wall pressure and wall pressure fluctuations in fluid
mechanics is of great importance for the investigation of turbulent flow
phenomena. This paper is focused on the design, fabrication and test of a micro
electromechanical system (MEMS) pressure sensor array for high-resolution wall
pressure measurements in turbulent flows. In contrast to pressure sensor arrays
in literature this array is highly sensitive and can be flush mounted on top of
a cylinder without using pin holes and flexible tubes. Employing
silicon-on-insulator (SOI) technology and deep silicon etching the sensors
developed achieve a pressure resolution of 0.5 Pa. Three different types of
sensors, featuring a diaphragm thickness of 3 μm and diaphragm sizes of 500 μm,
700 μm, and 900 μm (square diaphragm), have been fabricated and characterized.
Simulation of the dynamic behavior yields resonance frequencies of 50 kHz (900
μm-diaphragm), 82 kHz (700 μm-diaphragm), and 160 kHz (500 μm-diaphragm).
Sensitivities of 12 μV/(VPa) (900 μm-sensor), 7 μV/(VPa) (700 μm-sensor), and 3
μV/(VPa) (500 μm-sensor) are obtained in measurement ranges of ±200 Pa, ±500 Pa,
and ±1 kPa, respectively, featuring a non-linearity of less than 1%. The array
was flush mounted on a cylinder (radius 60 mm, height 240 mm) and tested in a
wind tunnel.
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PMN-PT Single Crystal Piezo-Electric Acoustic Sensor
Article
 * Jan 2007
 * Mater Res Soc Symp Proc

 * Sungq Lee
 * Hye Jin Kim
 * Sang Kyun Lee
 * Kang Ho Park

The MEMS (micro-electro-mechanical systems) microphone enables the manufacturing
of small mechanical components on the surface of a silicon wafer. The MEMS
microphones are less susceptible to vibration because of the smaller diaphragm
mass and an excellent candidate for chip-scale packaging. In this paper, we
present a piezoelectric MEMS microphone based on (1-x)Pb(Mg1/3Nb2/3)O3-xPbTiO3
(PMN-PT) single crystal diaphragm. The PMN-PT materials exhibit extremely high
piezoelectric coefficients and other desirable properties for an acoustic
sensor. The piezoelectric-based microphone can offer the ability to passively
sense without the power requirements. In particular, this paper introduces the
design of a PMN-PT single crystal diaphragm with interdigitated electrode. We
were able to fabricate miniaturized PMN-PT single crystal diaphragms. The
fabricated sensor exhibits the sensitivity of 1.5mV/Pa. This implies that the
PMN-PT thin film microphone has a potential of excellent acoustic
characteristics.
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Design and Characterization of a Micromachined Piezoelectric Microphone
Conference Paper
 * May 2005

 * Stephen Brian Horowitz
 * Louis Cattafesta
 * Toshikazu Nishida
 * Mark Sheplak

This paper presents the development of a micromachined piezoelectric microphone
for aeroacoustic measurement applications. The microphone consists of a circular
diaphragm of silicon possessing a thin annular ring of piezoelectric material
deposited at the edge of the diaphragm. The microphone was designed by combining
a linear piezoelectric composite plate model with a lumped-element,
electroacoustic model Experimental characterization indicates a sensitivity of
0.75 μV/Pa, a dynamic range of 47.8 -169 dB (re 20 μPa), and a resonant
frequency of 50.8 kHz.
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A Piezoelectric MEMS Microphone Based on Lead Zirconate Titanate (PZT) Thin
Films
Article
 * Nov 2004

 * Ronald G. Polcawich

Piezoelectric microelectromechanical (MEMS) scale acoustic sensors have
potential applications in a wide variety of applications including hearing aids,
surveillance, and heart monitoring. For each of these systems and many others,
the acoustic sensors must be miniaturized and have low power requirements. A
piezoelectric-based microphone can provide a solution to these requirements,
since it offers the ability to passively sense without the power requirements of
condenser or piezoresistive microphone counterparts. This research effort
reports on the design and fabrication of a piezoelectric
PbZr(0.52)Ti(0.48)O(3)(PZT) based acoustic sensor. A circular clamped membrane
consisting of a dielectric for structural support and a piezoelectric actuator
has been fabricated on a silicon wafer via silicon deep reactive ion etching
(DRIE). Sensors ranging from 500 to 2000 microns in diameter have been
fabricated and characterized with the use of scanning laser Doppler vibrometry
and calibrated acoustic tone source. The PZT sensors exhibited a sensitivity of
97.9 to 920 nV/Pa, depending on geometry.
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An ultrasensitive spintronic strain-gauge sensor and a spin-MEMS microphone
Article
 * Dec 2018
 * ELECTR COMMUN JPN

 * Yoshihiko Fuji
 * Michiko Hara
 * Yoshihiro Higashi
 * Hideaki Fukuzawa

This review provides the spintronic strain‐gauge sensor (Spin‐SGS) based on a
magnetic tunnel junction (MTJ) with a high gauge factor in excess of 5000, which
was realized by adopting a novel amorphous Fe‐B‐based sensing layer with high
magnetostriction and low coercivity in a high magnetoresistance Mg‐O barrier
MTJ. This review also provides a demonstration of novel “Spintronic MEMS
(Spin‐MEMS) microphone,” in which a series of Spin‐SGSs are integrated onto a
bulk micromachined diaphragm. The Spin‐MEMS microphone exhibits a
signal‐to‐noise ratio (SNR) of 57 dB(A) due to the high strain sensitivity of
the Spin‐SGSs.
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Aero-Micro-Electromechanical System Sensor Arrays for Time Resolved Wall
Pressure Measurements
Article
 * Apr 2009
 * AIAA J

 * Frank H Thiele
 * Andreas Berns
 * Ulrich Buder
 * E. Obermeier

Wall pressure and wall pressure fluctuations in turbulent flows are of interest
in many engineering applications. This paper focuses on the design and
fabrication of aero-micro-electromechanical system surface pressure sensor
arrays and their application to wall pressure measurements on a wall-mounted
cylinder. The sensor arrays have been developed to be highly sensitive and
mounted flush with the measurement surface. Thus, dynamic properties of the
sensors are not limited by tubing, and an accurate measurement of the wall
pressure and its fluctuations becomes possible. The arrays introduced herein
consist of a number of individual sensors, which feature a maximum sensitivity
of 12 mu V/(VPa) and a pressure resolution of up to 0.5 Pa. Employing six arrays
(three different types) consisting of upto 13 individual pressure sensors, wall
pressure measurements have been conducted at the University of Rostock at a
Reynolds number of 200,000. The results prove that the developed sensor arrays
are a powerful measurement tool for experimental fluid mechanics. The wall
pressure measurement data obtained are in good agreement with the results of the
laser Doppler anemometry measurements and large-eddy simulations, which are also
presented herein.
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Design and Fabrication of a Lead Zirconate Titanate (PZT) Thin Film Acoustic
Sensor
Article
 * Apr 2003
 * INTEGR FERROELECTR

 * M. Scanlon
 * J.S. Pulskamp
 * Madan Dubey
 * Ronald G. Polcawich

Piezoelectric MEMS acoustic sensors have potential applications in a wide
variety of applications including hearing aids, surveillance, heart monitoring,
etc. For each of these systems and many others, the acoustic sensors must be
miniaturized and have low power requirements. A piezoelectric based microphone
can provide a solution to these requirements, as they offer the ability to
passively sense without the power requirements of condenser or piezoresistive
microphone counterparts. This research effort reports on the design and
fabrication of a piezoelectric PZT based acoustic sensor. A circular clamped
membrane consisting of a dielectric for structural support and a piezoelectric
actuator has been fabricated on a silicon wafer using silicon deep reactive ion
etching (DRIE). Sensors ranging from 500–2000 microns in diameter have been
fabricated and characterized using scanning laser Doppler vibrometry and
calibrated acoustic tone sources. The PZT sensors exhibited a sensitivity of
97.9–920 nV/Pa depending on geometry.
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Characterization of a Microelectromechanical Systems (MEMS) Microphone
Conference Paper
 * May 2008

 * J. Patrick King
 * James Underbrink

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Characterization of Aeroacoustic, Silicon Micromachined Microphones for Aircraft
Fuselage Arrays
Article
 * Dec 2012

 * Matthew D. Williams
 * Benjamin A. Griffin
 * Tiffany N. Reagan
 * Mark Sheplak

This paper describes the design and characterization of a micromachined
microphone for aircraft fuselage arrays utilized by aeroacousticians to help
identify aircraft noise sources and/or assess the effectiveness of
noise-reduction technologies. The developed microphone utilizes piezoelectric
transduction via an integrated aluminum nitride layer in a thin-film composite
diaphragm fabricated using a combination of surface and bulk micromachining. The
experimental characterization of several microphones is presented. Measured
performance was in line with the Boeing Company specifications for the fuselage
array application, including sensitivities of 32.1 mu V/Pa to 43.7 mu V/Pa,
minimum detectable pressures as low as 40 dB (1 Hz bin at 1 kHz), confirmed
bandwidths up to 20 kHz, >100 kHz resonant frequencies, and 3% distortion limits
between 160 and 172 dB sound pressure level. With this performance, in addition
to the small sizes, these microphones are shown to be a viable enabling
technology for low-cost, high-resolution fuselage array measurements.
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ZnO thin film piezoelectric micromachined microphone with symmetric composite
vibrating diaphragm
Article
 * Apr 2017

 * Jun-Hong Li
 * Chenghao Wang
 * Wei Ren
 * Jun Ma

Residual stress is an important factor affecting the sensitivity of
piezoelectric micromachined microphone. A symmetric composite vibrating
diaphragm was adopted in the micro electro mechanical systems piezoelectric
microphone to decrease the residual stress and improve the sensitivity of
microphone in this paper. The ZnO film was selected as piezoelectric materials
of microphone for its higher piezoelectric coefficient d 31 and lower relative
dielectric constant. The thickness optimization of piezoelectric film on square
diaphragm is difficult to be fulfilled by analytic method. To optimize the
thickness of ZnO films, the stress distribution in ZnO film was analyzed by
finite element method and the average stress in different thickness of ZnO films
was given. The ZnO films deposited using dc magnetron sputtering exhibits a
densely packed structure with columnar crystallites preferentially oriented
along (002) plane. The diaphragm of microphone fabricated by micromachining
techniques is flat and no wrinkling at corners, and the sensitivity of
microphone is higher than 1 mV Pa⁻¹. These results indicate the diaphragm has
lower residual stress.
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An AlN MEMS Piezoelectric Microphone for Aeroacoustic Applications
Article
 * Apr 2012
 * J MICROELECTROMECH S

 * Matthew D. Williams
 * Benjamin A. Griffin
 * Tiffany N. Reagan
 * Mark Sheplak

This paper describes the development of a micro- machined microphone for
aircraft fuselage arrays that are utilized by aeroacousticians to help identify
aircraft noise sources and/or assess the effectiveness of noise-reduction
technologies. The developed microphone utilizes piezoelectric transduction via
an integrated aluminum nitride layer in a thin-film composite diaphragm. A
theoretical lumped element model and an associated noise model of the complete
microphone system are developed and utilized in a formal design-optimization
process. Optimal designs were fabricated using a variant of the film bulk
acoustic resonator process at Avago Technologies. The experimental
characterization of one design is presented here, and measured performance was
in line with sponsor specifications, including a sensitivity of -39 μV/Pa, a
minimum detectable pressure of 40.4 dB, a confirmed bandwidth up to 20 kHz, a
129.5-kHz resonant frequency, and a 3% distortion limit approaching 172 dB. With
this performance-in addition to its small size-this microphone is shown to be a
viable enabling technology for low-cost, high-resolution fuselage array
measurements.
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Principles of MEMS and MOEMS
Article
 * Jan 2006

 * N.P. Mahalik
 * Sunny E. Iyuke
 * Byung-Ha Ahn

A considerable amount of research is being carried out concerning the design and
development of existing systems that reach down into micro-and nanometer scale
levels. A technology that considers microscale sensors, actuators, valves,
gears, and mirrors embedded in semiconductor chips is referred to as
microelectromechanical systems, MEMS in short. In essence, MEMS are small,
integrated devices that combine electronics, electrical as well as mechanical
elements (Fig. 2.1). The size is in the order of a micrometer level. MEMS design
technology is an extended form of traditional fabrication techniques used for IC
(Integrated Circuit) manufacturing. MEMS add passive elements such as capacitors
and inductors including mechanical elements such as springs, gears, beams,
flexures, diaphragms, etc. MEMS are thus the integration of these elements on a
single substrate (wafer) developed through more advanced microfabrication and
micromachining technology. While the ICs are fabricated by the use of IC
process, the mechanical micro components are fabricated using micromachining
processes. This process helps in etching away the parts of the selected portions
of the wafer. The process can also add new structural layers to form mechanical
as well as electromechanical components. Thus, MEMS technology promises to
revolutionise many products by combing microfabrication-based microelectronics
with micromachining process sequences on silicon, making it possible for the
realisation of a complete systems-on-a-chip (SoC). The technology allows for the
development of smart systems and products inheriting increased computational
capability, perception and control attributes. Smart systems can lead to expand
the scope of possible solutions to diagnostics for target applications. It has
been mentioned that microelectronic integrated circuits can be thought of as the
brains of a system while MEMS augments the decision-making capability with eyes
and arms, to allow microsystems to sense and control the environment
(http://www.memsnet.org/mems/ what-is.html). MEMS devices are manufactured by
the use of batch fabrication techniques similar to those used for IC. Therefore,
unparalleled levels of superiority, sophistication, functionality, reliability
and availability can be achieved on a small silicon chip at a relatively low
cost. Two important microsystems are microsensors and microactuators. Sensors
gather information from the environment. The commonly used transduction
principles are chemical, thermal, biological, optical, magnetic and mechanical
phenomena. Accordingly, there are various types of microsensors. The integrated
electronics process the information derived from the sensors. In many cases the
decision-making logics are integrated into the devices. The decision is mostly
transmitted to the actuator in order to achieve moving, positioning, regulating,
pumping or filtering actions. In this way, the environment can be controlled
depending on the desired purpose. The study of MEMS accommodates the topics
listed below. These principles are presented in this chapter. • Fabrication
processes • Mechanical sensors and actuators • Thermal MEMS • Magnetic MEMS •
Micro-opto-electromechanical systems (MOEMS).
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Noise Modeling and Characterization of Piezoresistive Transducers
Conference Paper
 * Jan 2006

 * Gijs Bosman
 * Toshikazu Nishida
 * Robert Dieme
 * Mark Sheplak

This paper presents detailed results on noise modeling and experimental
characterization applicable to piezoresistive MEMS transducers using a
piezoresistive MEMS microphone as an example. To accurately model the lower
limit of the dynamic range of piezoresistive MEMS transducers, a detailed noise
equivalent circuit, piezoresistor noise model, and experimental noise
measurements are needed. From the sensitivity and the total root-mean-square
output noise, the minimum detectable signal (MDS) may be computed. Key
experimental results include comparison of the DC bridge and AC bridge noise
measurement techniques and use of the AC measurement technique when the
piezoresistive transducer output noise is less than the low frequency DC setup
noise.
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High Frequency MEMS Sensor for Aeroacoustic Measurements
Article
 * Jan 2013

 * Zhijian J. Zhou

Aero-acoustics, a branch of acoustics which studies noise generation via either
turbulent fluid motion or aerodynamic forces interacting with surfaces, is a
growing area and has received fresh emphasis due to advances in air, ground and
space transportation. Microphones with a bandwidth of several hundreds of kHz
and a dynamic range covering 40Pa to 4kPa are needed for aero-acoustic
measurements. In this thesis, two metal-induced-lateral-crystallized (MILC)
polycrystalline silicon (poly-Si) based piezoresistive type MEMS microphones are
designed and fabricated using surface micromachining and bulk micromachining
techniques, respectively. These microphones are calibrated using an electrical
spark generated shockwave (N-wave) source. For the surface micromachined sample,
the measured static sensitivity is 0.4μV/V/Pa, dynamic sensitivity is
0.033μV/V/Pa and the frequency range starts from 100kHz with a first mode
resonant frequency of 400kHz. For the bulk micromachined sample, the measured
static sensitivity is 0.28μV/V/Pa, dynamic sensitivity is 0.33μV/V/Pa and the
frequency range starts from 6kHz with a first mode resonant frequency of 715kHz.
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An Instrumentation Grade MEMS Condenser Microphone for Aeroacoustic Measurements
Conference Paper
 * Jan 2008

 * David Martin
 * Karthik Kadirvel
 * Toshikazu Nishida
 * Mark Sheplak

This paper presents improved results of an instrumentation-grade dual-backplate
condenser microphone. This device is designed for aeroacoustic applications that
require a high dynamic range and large bandwidth. Previous testing of the
microphone with a charge amplifier to reduce attenuation due to parasitic
capacitance yielded an unacceptably high noise floor. In this study, the noise
floor of the microphone is lowered through the use of a low-noise voltage
amplifier. With bias voltages of ±9.3 V, a sensitivity of 172 μV/Pa and a noise
floor of 22.5 dB/√Hz are obtained. The noise floor is reduced to below that of
other MEMS-based aeroacoustic microphones while maintaining suficient bandwidth
and maximum pressure.
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Show abstract
Development of a MEMS Dual Backplate Capacitive Microphone for Aeroacoustic
Measurements
Conference Paper
 * Jan 2006

 * David Martin
 * Jian Liu
 * Karthik Kadirvel
 * Toshikazu Nishida

This paper presents the development of a micromachined dual backplate condenser
microphone designed for aeroacoustic applications where a high dynamic range and
high bandwidth are key requirements. The microphone consists of a circular
diaphragm and two porous backplates that are each comprised of doped
polysilicon. The microphone was designed using both a lumped element model of
the microphone and elastic plate theory. Experimental characterization indicates
a sensitivity of 282 V/Pa, a linear response up to 160 dB, a noise floor of 42
dB/√Hz at 1 kHz, a flat frequency response up to 20 kHz, and a resonant
frequency of 230 kHz.
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Show abstract
A MEMS-based sound intensity probe
Conference Paper
 * May 2003

 * Susana Tuzzo
 * David Martin
 * Toshikazu Nishida
 * Mark Sheplak

A new type of a sound intensity probe employing microelectromechanical systems
(MEMS)-based microphones is presented. The intensity probe operates on the p-p
principle that uses two pressure signals to calculate one component of the sound
intensity vector. The MEMS intensity probe consists of two hybrid-packaged
silicon-micromachined piezoresistive microphones mounted in a solid rigid sphere
of known diameter. This arrangement enables an analytical correction for probe
scattering effects. The MEMS intensity probe is calibrated in a free field and
compared with a commercial Brüel & Kjær 3599 intensity probe and a single
microphone. Experimental data reveal good agreement between all three probes.
These results demonstrate the potential of extending this technique to three
dimensions. © 2003 by the University of Florida. Published by the American
Institute of Aeronautics and Astronautics, Inc.
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Show abstract
Piezoresistive Microphone Design Pareto Optimization: Tradeoff Between
Sensitivity and Noise Floor
Article
Full-text available
 * Jan 2007
 * J MICROELECTROMECH S

 * Melih Papila
 * Raphael Haftka
 * Toshikazu Nishida
 * Mark Sheplak

This paper addresses tradeoffs between pressure sensitivity and electronic noise
floor in optimizing the performance of a piezoresistive microphone. A design
optimization problem is formulated to find the optimum dimensions of the
diaphragm, the piezoresistor geometry and location for two objective functions:
maximum pressure sensitivity and minimum electronic noise floor. The Pareto
curve of optimum designs for both objectives is generated. The minimum
detectable pressure (MDP) was also employed as an objective function, generating
a point on the Pareto curve that may be the best compromise between the original
two objectives. The results indicated that this application the critical
constraints are the linearity and power consumption. The minimized MDP design
was less sensitive to uncertainty in design variables. The optimization
methodology presented in this paper as well as some of the conclusions are
applicable to other types of piezoresistive sensors
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A wafer-bonded, silicon-nitride membrane microphone with
dielectrically-isolated, single-crystal silicon piezoresistors
Article
 * Jan 1998

 * Mark Sheplak
 * K.S. Breuer
 * M.A. Schmidt

View
Analytical characterization of piezoresistive square-diaphragm silicon
microphone
Article
 * Jan 1996
 * SENSOR MATER

 * Edvard Kälvesten
 * Lennart Löfdahl
 * Göran Stemme

An analytical energy method has been used to derive the characteristics of a
square-diaphragm piezoresistive silicon microphone. All relevant mechanical and
acoustical effects of the sensor characteristics are included in the method.
First, the energy contributions are calculated and then identified with
equivalent acoustical impedances. These equivalent impedances are used in the
electrical analogy. The method is applied to a piezoresistive microphone having
a square diaphragm over its cavity. A special vent channel which equalizes the
static air pressure between the cavity and the ambient has been included in the
model. Good agreement between the theoretical analysis and experimental data on
fabricated microphones was obtained.
View
Show abstract
Low pressure acoustic sensors for airborne sound with piezoresistive
monocrystalline silicon and electrochemically etched diaphragms
Article
 * Feb 1995
 * SENSOR ACTUAT A-PHYS

 * R. Schellin
 * M. Strecker
 * U. Nothelfer
 * G. Schuster

In this paper experimental results and theoretical considerations of an acoustic
silicon sensor for airborne sound, which is based on boron-implanted
monocrystalline piezoresistors located on an electrochemically etched silicon
diaphragm, are presented. The bandwidth of the sensor is nearly 20 kHz (full
audio bandwidth), a maximum sensitivity of 80 μV Pa−1 (bias voltage, 8 V) was
achieved and a lowest equivalent noise level of about 61 dB(A) was measured. The
membrane thickness is about 1.3 μm; the membrane area amounts to 1 mm2.
Furthermore, a good reproducibility and linearity could be obtained. The weak
sensitivity can mainly be explained by a residual inherent tensile stress in the
silicon-silicon dioxide-silicon nitride layer system of the diaphragm and by the
large geometric dimensions of the resistors.
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Show abstract
Ambient humidity and moisture — a decisive failure source in piezoresistive
sensors
Article
 * Feb 1995
 * SENSOR ACTUAT A-PHYS

 * Karsten Sager
 * Gerald Gerlach
 * A. Nakladal
 * Andreas Schroth

Piezoresistive sensors have found widespread applications (e.g. in the car
industry, chemical processes, industrial measurement techniques, etc.). In many
cases a hermetic encapsulation of the sensor elements is impossible, so that
humidity, moisture or other forms of pollution in disturbing quantities can
attack the sensor chip besides the well-known influence of the ambient
temperature. In this paper we present the results of metrological investigations
that deal with the influence of humidity and moisture on the stability of the
output voltage of piezoresistive sensors. The main conclusion is that the
influence of humidity and moisture on the sensor behaviour cannot be neglected.
The forming of condensed water on the sensor surface causes changes in the
sensor offset voltage up to the nominal output voltage during time ranges of
0.1–0.5 h. Disturbing processes induced by condensation did not cause any
irreversible change in the zero offset voltage of the sensors during the
investigation time range. The observed humidity-induced instabilities of sensor
output voltage are caused by very complex physical and chemical mechanisms,
which are described in this paper.
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Show abstract
A small-size silicon microphone for measurements in turbulent gas flows
Article
 * Nov 1994
 * SENSOR ACTUAT A-PHYS

 * Edvard Kälvesten
 * Lennart Löfdahl
 * Göran Stemme

For the first time a silicon microphone specially designed for measurements in
turbulent gas flows has been fabricated and tested. The new design, based on
surface-micromachining techniques, has a very small pressure-sensitive
polysilicon diaphragm of 100 μm side length and 0.4 μm thickness with
polysilicon piezoresistive strain gauges. The small diaphragm makes it possible
to resolve and measure the pressure fluctuations of the smallest eddies in a
turbulent flow. In order to achieve a sufficiently high acoustic pressure
sensitivity, a relatively deep (3 μm) cavity is formed below the diaphragm by
using the sacrificial-layer etching technique. A special vent channel is
designed to give an equalization of the static air pressure between the cavity
and the ambient without degrading the dynamic pressure response of the
microphone. The device has a very flat frequency-response curve within ±2 dB
between 10 Hz and 10 kHz and an acoustic sensitivity of 0.9 μV Pa−1 for a supply
voltage of 10 V. It has been shown that the new sensor fulfils the requirements
for pressure measurements in turbulence. The microphone frequency response has
been calculated using an electrical analogy. Comparisons with experimental data
are presented.
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Show abstract
Effect of Surface Treatment on Electromigration in Aluminum Films
Article
 * Jan 1990
 * IEEE T RELIAB

 * Tetsuaki Wada
 * Masao Sugimoto
 * Tsuneo Ajiki

Surface treatment methods for educing aluminum electromigration are studied.
Simple methods for reducing aluminum electromigration have been found.
Oxygen-plasma treatment and a H<sub>2</sub>O<sub>2</sub> dip after aluminum
patterning are shown to improve conductor life with respect to electromigration.
By the oxygen-plasma treatment, the mean times to failure is improved more than
two time over that for the current method. This improvement of life is a
function of the oxygen-plasma treatment time and is affected by aluminum
annealing and the material used for passivation. By H<sub>2</sub>O<sub>2</sub>
dip treatment, the mean time to failure is improved more than three times over
that obtained using the current method. This improvement of life depends on the
aluminum area exposed to the H<sub>2</sub>O<sub>2</sub> dip. The improvement of
conductor life due to surface treatments can be explained by suppression of the
aluminum surface and/or grain diffusivity due to oxidation of the aluminum
surface
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Show abstract




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A PIEZORESISTIVE MICROPHONE FOR AEROACOUSTIC MEASUREMENTS

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 * Sridhar Gururaj
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This paper presents the characterization of a piezoresistive silicon microphone.
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... [Show full abstract] diaphragm. Multiple devices were characterized in terms
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Last Updated: 05 Jul 2022



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