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SOLVING YOUR
STORAGE CHALLENGES

Amphenol provides high-density, high performance
interconnect solutions for server and storage equipment
used in multiple applications and markets

View Solutions

 * New Products
 * Focus Products

PCI Express® Gen 6 Card Edge Connectors
Amphenol PCIe® Gen 6 connectors exceed industry standard PCIe® 6.0 performance
requirements. The optimized series supports backward compatible and is footprint
interchangeable with PCIe® 5/4/3/2/1.

FlexFast™ Flex-to-Board
FlexFast™ FPC-to-Board connector's compact design address the growing demand for
automotive application market. The connector design is compliant to USCAR-T3V2
and LV-214 S1 specifications.

Minitek MicroSpace™ High Voltage selective loaded Crimp-to-Wire Connector
Platform
Minitek MicroSpace™ High Voltage selective loaded Crimp-to-Wire connector
platform's unique design enables LV214 Severity-2 and performs at 3.81mm,
6.35mm, and 8.89mm pitch with 400V, 800V and 1200V.

ExtremePort™ QSFP 112G
Amphenol's ExtremePort™ QSFP 112G interconnect system is comprised of a
38-position, 0.8mm pitch connector built for use in high speed serial
applications. Each port offers 4 channels which increases port density, frees up
board real estate and delivers a cost optimized solution. The ExtremePort™ QSFP
112G connector supports next generation 400G applications and transmits up to
112Gb/s PAM4 per channel.

Flexible Printed Circuit Assembly
BROAD OFFERING/HIGH PERFORMANCE/COST SAVING/CUSTOMIZED/VALUE ADDED FLEX CABLE
ASSEMBLY Amphenol's BergStak®, MezzoStak®, Conan®, ComboStak® and PowerStak® are
industry proven board-to-board solutions. To enlarge the advantages of these
recognized board-to-board solutions, we have expanded our offering with Flexible
Printed Circuit (FPC) assemblies,...

IDC Solutions
IDC connectors are small electronic components that help connect wires to
circuit boards. They are commonly used in computers and other electronic devices
to ensure fast and reliable connections between different components. These
connectors work by piercing the insulation of a flat cable, making contact with
the conductors inside.

QSFP DD Cable Assemblies
Amphenol's QSFP DD (Double Density) passive copper cable assemblies double the
number of channels from 4 to 8 lanes when compared to the existing 100G QSFP
cabling systems, enabling more bandwidth within the same mechanical envelope.
Compatible with 25G/Lane NRZ up to 112G/Lane PAM4 signaling protocols that allow
cables to deliver aggregate bandwidths of 200G, 400G, and 800G per cable
assembly. Available in both Passive, Active and Loopback variants.

OSFP OverPass™ Assemblies
OSFP OverPass™ products remove high speed signaling from the PCB and create an
eight channel direct lower loss interconnection between the ASIC site and the
external OSFP IO port by overpassing the PCB. This helps to enable 56G and 112G
hardware system designs and a technology for future 224G systems. Using these
solutions results in lower over signal loss, less PCB design complexity and
reduces PCB costs. Fully compatible with OSFP industry standards and with both
high speed and sideband signal requirements.



 * E-MOBILITY
   
   Amphenol provides a broad array of compact, robust,
   leading-edge interconnect solutions.
   SELECT YOUR APPLICATION TODAY
   

Connect Blog
LEARN MORE
The Fastest Path to Wireless Charging with Amphenol and NuCurrent
Shanghai Amphenol Airwave Communication Electronics Co., Ltd, a subsidiary of
Amphenol Corporation has partnered with NuCurrent, a global player in wireless
power systems. This partnership will address the need to shift toward new
standards such as Qi2 (pronounced “cheē tü”) standard.
LEARN MORE
Solutions for OCP Server and Storage
The Open Compute Project (OCP) is a collective of industry experts joining
forces to revamp hardware technology in order to meet the growing demands on
computing infrastructure. Established in 2011, the Open Compute Project
Foundation (OCP) leverages the benefits of open source and teamwork to
accelerate innovation in data center technology, including networking equipment,
servers, storage devices, and scalable rack designs.
LEARN MORE
Space-Saving PCIe® Gen 5 Flip CEM
The PCIe® Gen 5 Flip CEM is a newly introduced vertical card edge connector that
adheres to the PCIe® standard mating interface. Its unique design features "JJ"
or "LL" type contacts, resulting in a significant reduction of up to 19.5% in
the keep-out area compared to traditional CEM connectors.
 * INDUSTRY TRENDS
   Power Cable Assemblies
   Designed to provide reliable and efficient power transmission in a variety of
   applications by using cutting-edge manufacturing techniques. Learn More
   

 * Trending
   
    * Quantum Computing
    * 112G High Speed Solutions
    * 224G High-Speed Solutions
    * OverPass Solutions

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We love a challenge!

CUSTOM INTERCONNECT SOLUTIONS, GLOBAL MANUFACTURING FOOTPRINT



Custom

Our engineering teams collaborate with our customers on 1000’s of projects every
year, so no matter what technical, operational and even commercial challenges
you face, Amphenol CS can develop a solution for you!

Plating

Our engineering teams have built a solid reputation with our customers,
partnering with them every step of the way from concept and design to prototype
and final production, in order to fulfill your custom requirements.

Expertise

Amphenol CS brings a broad array of innovative technology and solutions to
support the growth of Information, Communications and Commercial electronics
markets, particularly in plating, signal integrity performance, and power
management.

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