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Neil Tyler
24 Oct 2024

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GLOBALFOUNDRIES AND NXP TO DELIVER NEXT GENERATION 22FDX SOLUTIONS

News
1 min read

GlobalFoundries and NXP Semiconductors are collaborating on next-generation
solutions across a range of end markets including automotive, IoT and smart
mobile devices.


Credit: ryanking999 - adobe.stock.com

The collaboration leverages GF’s 22FDX process technology platform and global
manufacturing footprint to support NXP’s solutions. GF’s 22FDX chips will be
manufactured in Dresden and Malta, New York, providing NXP with a geographically
diverse supply for their customers.

The new collaboration, which builds on a long-term relationship between NXP and
GF, will enable NXP to provide more compact and power-efficient solutions while
increasing the overall performance of their system solutions.

The companies will leverage GF’s 22FDX platform, which optimises performance by
dynamically adjusting to the lowest possible voltage, delivering ultra-low power
consumption and high performance for the most demanding applications.

The 22FDX process was purpose-built for intelligence at the edge and optimises
energy management to deliver up to a 50% higher performance while reducing power
consumption by up to 70% when compared to other planar CMOS technologies.

“NXP’s portfolio of high-performance solutions is crucial to enabling the
essential technologies at the centre of our increasingly connected world,” said
Andy Micallef, executive vice president and chief operations and manufacturing
officer at NXP.  “GF’s 22FDX platform’s power efficiency and enhanced
performance effectively enables our customers to build the next generation of
connected and secure solutions. Additionally, GF’s robust manufacturing presence
for 22FDX in Germany and the US helps support our goals of having supply control
and geographic resilience in our manufacturing base.”

The 22FDX platform also maximises performance per area by integrating digital,
analogue, RF, power management, and non-volatile memory (NVM) onto a single die.
The platform also delivers responsive and reliable wireless connectivity for
simple and secure connections.

Integrated NVM reduces power consumption and latency while improving security,
which is especially important given the growing memory footprint for Edge AI
processors.

Through this integration, NXP will be able to create a one-stop shop platform to
serve multiple markets while maximizing IP reuse.

With technology qualified for Automotive Grade 1 and 2 applications, 22FDX
ensures reliability in extreme automotive conditions and, as part of GF’s
AutoPro solutions, the platform includes advanced temperature-resistant
capabilities up to 150°C junction temperature, which is critical to ensuring the
long-term durability and safety of vehicle electronic systems.

The two companies previously worked together on a joint development of 40nm NVM
technology, so GF is well positioned to support NXP’s next-gen solutions using
its FDX and FDX+ platforms.

Electronics
Manufacturing
Semiconductors
http://www.gf.com
http://www.nxp.com

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