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 * ABOUT
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    * Company profile
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    * Company history
    * One-stop service
    * Co-operative partners

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    * PCB
    * PCBA
    * IC components

 * APPLICATION
   <<
    * Automotives
    * Communication
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END-TO-END PARTNERSHIP SOLUTIONS

Welcome to Tecsim Circuits. Service include PCB, PCBA, IC-chips sourcing. 

IC-chips sourcing: Strong lines TI, ST, NXP, Infineon, ADI, Xilinx, Onsemi,
Microchip, Renesas,Vishay etc.


Request a Quote



TECSIM ELECTRONIC CIRCUITS CO., LTD.

Tecsim Electronic Circuits Co., Ltd. founded in 2008, is a one-stop PCBA
solution service provider who integrates PCB Layout, PCB manufacturing, PCBA
solution and product design, component procurement, SMT, DIP, finished product
assembly and testing, having over 20 years of experience in serving many
domestic and foreign brand customers in a wide range of fields such as Medical,
Automotive, Industrial, Automation, Artificial Intelligence, Smart Home,
Security, Power and Communications etc.


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EXCELLENT PRODUCTS


FLEXIBLE SINGLE SIDED


FLEXIBLE DOUBLE SIDED


FLEXIBLE MULTILAYER BOARD


SINGLE SIDED FLEX CIRCUITS


FIBRE-GLASS PRINTED CIRCUIT BOARD


ALUMINUM PCB


COPPER BASED CIRCUIT BOARD


CERAMIC CIRCUIT BOARD


FLEXIBLE SINGLE SIDED


FLEXIBLE DOUBLE SIDED


FLEXIBLE MULTILAYER BOARD


SINGLE SIDED FLEX CIRCUITS


FIBRE-GLASS PRINTED CIRCUIT BOARD


ALUMINUM PCB


COPPER BASED CIRCUIT BOARD


CERAMIC CIRCUIT BOARD


FLEXIBLE SINGLE SIDED


FLEXIBLE DOUBLE SIDED


FLEXIBLE MULTILAYER BOARD


SINGLE SIDED FLEX CIRCUITS


FIBRE-GLASS PRINTED CIRCUIT BOARD


ALUMINUM PCB


COPPER BASED CIRCUIT BOARD


CERAMIC CIRCUIT BOARD






FIBRE-GLASS PRINTED CIRCUIT BOARD


ALUMINUM PCB


COPPER BASED CIRCUIT BOARD


CERAMIC CIRCUIT BOARD


FLEXIBLE SINGLE SIDED


FLEXIBLE DOUBLE SIDED


FLEXIBLE MULTILAYER BOARD


SINGLE SIDED FLEX CIRCUITS

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WHY CHOOSE TECSIM ELECTRONIC



Prompt Responses

Quality Commitment

Short Lead Time



Stellar Customer Service

2 Years Warranty

Payment Term Extension




WE ARE GOOD AT SOLVING VARIOUS COMPLEX PROBLEMS FOR CUSTOMERS



Whether you are in search of complete end-to-end engineering, design, pcb, pcba,
components sourcing and manufacturing solutions, or need support at any phase of
the product development lifecycle, Tecsim Circuits stands as your single-source
partner for the most demanding manufacturing requirements. We are committed to
strict, mission-critical, high-reliability, and high-quality product
specifications that must be precisely right.




APPLICATION FIELD




 * AUTOMOTIVE


 * COMMUNICATIONS


 * INDUSTRY CONTROL


 * MEDICAL


 * NEW ENERGY


 * ARTIFICIAL INTELLIGENC


 * AUTOMOTIVE


 * COMMUNICATIONS


 * INDUSTRY CONTROL


 * MEDICAL


 * NEW ENERGY


 * ARTIFICIAL INTELLIGENC

   


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COMPANY NEWS




 * SHORTAGE OF AI CHIPS OR CAUSING THOUSANDS OF COMPANIES TO DELAY THE LAUNCH OF
   GENERATIVE AI PRODUCTS
   
   With the United States doubling restrictions on selling artificial
   intelligence chips to China, the demand and prices for these devices remain
   high even in the open market. According to Deloitte Insights, the current
   demand will be temporarily met due to increased supply and new suppliers, but
   it is unclear what will happen afterwards.
   2023-12-14
   查看详情


 * GLOBAL SEMICONDUCTOR EQUIPMENT SALES ARE EXPECTED TO REACH $124 BILLION BY
   2025
   
   On the 13th, International E-commerce News reported that although global
   semiconductor manufacturing equipment sales have decreased by 6.1% compared
   to the previous year, with support from the front-end and back-end sectors
   2023-12-13
   查看详情


 * MVG TESTING AND MEASUREMENT SOLUTIONS ENSURE THE SAFETY, STABILITY, AND
   EFFICIENCY OF AUTOMOTIVE ANTENNA COMMUNICATION PERFORMANCE
   
   With the emergence of the next generation of advanced driving assistance
   systems and the increasing popularity of in vehicle entertainment devices,
   vehicles are using a large amount of wireless technology to achieve the
   connection between vehicle to vehicle (V2V), vehicle to infrastructure (V2I),
   and vehicle to network (V2N). For all stages of product development, design,
   and deployment, MVG has dedicated independent antenna testing, airborne (OTA)
   measurement solutions, and simulation software solutions for the automotive
   industry.
   2023-11-27
   查看详情


 * A THOUSAND CABIN ATMOSPHERE LIGHTS ONLY REQUIRE ONE MCU! OSP BUS CONNECTS
   LEDS AND SENSORS
   
   The OSP bus is a serial bus, and with this bus architecture, the MCU side no
   longer requires additional costs, only interfaces are needed to connect. A
   differential bus can carry 1000 nodes, which can be understood as 1000
   lights. Previously, it used to require several or even dozens of drivers to
   carry 1000 lights, but now it only requires a bus with two wires to string
   these 1000 lights together
   2023-10-23
   查看详情

 * 【Industry News】Shortage of AI chips or causing thousands of companies to
   delay the launch of generative AI products
   2023-12-14
 * 【Industry News】Global semiconductor equipment sales are expected to reach
   $124 billion by 2025
   2023-12-13
 * 【Industry News】MVG testing and measurement solutions ensure the safety,
   stability, and efficiency of automotive antenna communication performance
   2023-11-27
 * 【Industry News】A thousand cabin atmosphere lights only require one MCU! OSP
   bus connects LEDs and sensors
   2023-10-23


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OUR PARTNER




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About 


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Contact

Products

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PCBA

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Application

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Communication

Industry Control

Medical

New energy

Artificial Intelligence



Contact 

Website：www.tecsimcircuits.com

Email：sales@tecsimcircuits.com

Tel：+86 136 7029 6206

Add：Unit 2A, Room 502, Hezhengdanjun Building, No. 123, Shaping South Road,
Longgang District, Shenzhen

Factory address: Building A, Building B, Danzhutou Science and Technology Park,
Longgang District, Shenzhen

Copyright © Tecsim Electronic Circuits Co., Ltd. All rights reserved