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Custom Interconnect Solutions, Global Manufacturing Footprint
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Focus Products

UltraPort™ QSFP+

Amphenol's UltraPort™ QSFP+ interconnect system comprises of a 38-position,
0.8mm pitch connector built for use in high speed serial applications. Each port
offers 4 channels to increase port density which allows more board real estate
and cost optimized solutions.

ExaMAX2® 112Gb/s High-Speed Backplane

The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry
specifications. It maintains mating interface compatibility with previous ExaMAX
products to allow cost/performance flexibility for designers.

Lynx™ QD

Optimized for differential pair signaling, Lynx™ QD sets a new standard for
density and flexibility that offers an innovative, high performance interconnect
with PCIe® Gen 5 support. Lynx™ QD supports data rates of 56 Gb/s PAM4 and
provides a 4 row differential signaling structure, in a compact 2 row footprint.

Double Density Cool Edge 0.80mm

The 0.80mm pitch Double Density Cool Edge connectors and cable assemblies offer
a compact design with 2 rows of contacts.

Quickie® IDC Cable-to-Board

FCI Basics Quickie® is a complete solution for flat cable-to-board connections
using 2.54mm pitch IDC technology. The highly durable and cost-saving connectors
come with specialized features in polarization, plating, and structure.

Zhaga Book 20 Compliant FLM Series

The FLM Series products are compliant with the Zhaga Book 20. Zhaga Book 20
specifies 2 position connectors identified as Luminaire Extension Module
Receptacles (LEX-MR) and Luminaire Plugs (LEX-LP), used for DALI-2 (Digital
Addressable Lighting Interface) applications.

DDR5 SO-DIMM

DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of
regular DIMMs, they lower power consumption and promote better thermal
management.

ExtremePort™ SFP+

Amphenol's ExtremePort™ SFP+ interconnect system is comprised of a 20-position
hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It
supports up to 56Gb/s PAM4 aggregate bandwidth with a backward compatibility for
next generation Ethernet and Fibre Channel applications.

UltraPort™ QSFP+

Amphenol's UltraPort™ QSFP+ interconnect system comprises of a 38-position,
0.8mm pitch connector built for use in high speed serial applications. Each port
offers 4 channels to increase port density which allows more board real estate
and cost optimized solutions.

ExaMAX2® 112Gb/s High-Speed Backplane

The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry
specifications. It maintains mating interface compatibility with previous ExaMAX
products to allow cost/performance flexibility for designers.

Lynx™ QD

Optimized for differential pair signaling, Lynx™ QD sets a new standard for
density and flexibility that offers an innovative, high performance interconnect
with PCIe® Gen 5 support. Lynx™ QD supports data rates of 56 Gb/s PAM4 and
provides a 4 row differential signaling structure, in a compact 2 row footprint.

Double Density Cool Edge 0.80mm

The 0.80mm pitch Double Density Cool Edge connectors and cable assemblies offer
a compact design with 2 rows of contacts.

Quickie® IDC Cable-to-Board

FCI Basics Quickie® is a complete solution for flat cable-to-board connections
using 2.54mm pitch IDC technology. The highly durable and cost-saving connectors
come with specialized features in polarization, plating, and structure.

Zhaga Book 20 Compliant FLM Series

The FLM Series products are compliant with the Zhaga Book 20. Zhaga Book 20
specifies 2 position connectors identified as Luminaire Extension Module
Receptacles (LEX-MR) and Luminaire Plugs (LEX-LP), used for DALI-2 (Digital
Addressable Lighting Interface) applications.

DDR5 SO-DIMM

DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of
regular DIMMs, they lower power consumption and promote better thermal
management.

ExtremePort™ SFP+

Amphenol's ExtremePort™ SFP+ interconnect system is comprised of a 20-position
hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It
supports up to 56Gb/s PAM4 aggregate bandwidth with a backward compatibility for
next generation Ethernet and Fibre Channel applications.

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next


New Products

QSFP DD OverPass™ Assemblies

QSFP DD OverPass™ products remove high speed signaling from the PCB and create
an eight channel direct lower loss interconnection between the ASIC site and the
external QSFP DD IO port by overpassing the PCB.

micro-LinkOVER™ OverPass™ Assemblies

micro-LinkOVER™ OverPass™ products remove high speed signaling from the PCB and
create a double ended, high performance cabling interconnect by overpassing the
PCB.

DensiLink® OverPass™ Assemblies

DensiLink® OverPass™ products remove high speed signaling from the PCB and
create a double ended, high performance cabling interconnect. These cables
support 56G and 112G signaling in hardware system designs as well as technology
for future 224G signaling systems.

PwrBlade® MiniMezz

The PwrBlade® Mini connector series introduces enhanced features to our existing
PwrBlade® products in a smaller profile. PwrBlade® MiniMezz is available in
stack heights ranging from 8mm - 20mm with options for power & signal contacts.

Hermetic Connector

Amphenol offers glass/epoxy sealed Hermetic Connectors which offer a highly
reliable electrical connection at both ends serving as a feed through.

ix Industrial™ IP6X Rectangular

The ix Industrial™ IP6X Rectangular Push-Pull connector and cable solution
provides Cat6A Ethernet connectivity using the IEC 61076-3-124 mating interface,
and full sealing to IP65, IP66 and IP67 specifications.

QSFP OverPass™ Assemblies

QSFP OverPass™ products the high speed signaling from the PCB and create a four
channel direct lower loss interconnection from the ASIC site to the external IO
port by overpassing the PCB.

OSFP OverPass™ Assemblies

OSFP OverPass™ products remove high speed signaling from the PCB and create an
eight channel direct lower loss interconnection between the ASIC site and the
external OSFP IO port by overpassing the PCB.

QSFP DD OverPass™ Assemblies

QSFP DD OverPass™ products remove high speed signaling from the PCB and create
an eight channel direct lower loss interconnection between the ASIC site and the
external QSFP DD IO port by overpassing the PCB.

micro-LinkOVER™ OverPass™ Assemblies

micro-LinkOVER™ OverPass™ products remove high speed signaling from the PCB and
create a double ended, high performance cabling interconnect by overpassing the
PCB.

DensiLink® OverPass™ Assemblies

DensiLink® OverPass™ products remove high speed signaling from the PCB and
create a double ended, high performance cabling interconnect. These cables
support 56G and 112G signaling in hardware system designs as well as technology
for future 224G signaling systems.

PwrBlade® MiniMezz

The PwrBlade® Mini connector series introduces enhanced features to our existing
PwrBlade® products in a smaller profile. PwrBlade® MiniMezz is available in
stack heights ranging from 8mm - 20mm with options for power & signal contacts.

Hermetic Connector

Amphenol offers glass/epoxy sealed Hermetic Connectors which offer a highly
reliable electrical connection at both ends serving as a feed through.

ix Industrial™ IP6X Rectangular

The ix Industrial™ IP6X Rectangular Push-Pull connector and cable solution
provides Cat6A Ethernet connectivity using the IEC 61076-3-124 mating interface,
and full sealing to IP65, IP66 and IP67 specifications.

QSFP OverPass™ Assemblies

QSFP OverPass™ products the high speed signaling from the PCB and create a four
channel direct lower loss interconnection from the ASIC site to the external IO
port by overpassing the PCB.

OSFP OverPass™ Assemblies

OSFP OverPass™ products remove high speed signaling from the PCB and create an
eight channel direct lower loss interconnection between the ASIC site and the
external OSFP IO port by overpassing the PCB.

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next


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