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Submission: On July 16 via manual from US — Scanned from CA
Effective URL: https://resources.system-analysis.cadence.com/
Submission: On July 16 via manual from US — Scanned from CA
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Skip to main content SYSTEM ANALYSIS * PCB Design & Analysis * Email * I have read/accept the Cadence Terms of Use and Privacy Policy. Subscribe Toggle menubar Cadence System Analysis * Toggle submenu for: Learn by Topic * Power Integrity Analysis * RF/Microwave Design * Thermal Analysis * Signal Integrity Analysis * 3D Electromagnetic Analysis * Computational Fluid Dynamics * Toggle submenu for: Design Insights * eBooks * White Papers and Conference Papers * Toggle submenu for: Product Insights * Datasheets & Technical Briefs * Success Stories * Application Notes * Toggle submenu for: Videos * Product Videos * Tech Tips & Webinars * Training * Tutorials * Latest Blogs * View All * Contact Us Open search box Search sitewide Close search box Share this Stream SHARE THIS STREAM * Share on facebook * Share on twitter * Share on linkedin * Share on email CADENCE SYSTEM ANALYSIS Solving electromagnetic, RF, thermal, and SI/PI simulation challenges to ensure your system works LATEST CONTENT STAY CONNECTED WITH THE LATEST NEWS, RESOURCES, AND PRODUCT INFORMATION FOR ALL OF YOUR SYSTEM DESIGN NEEDS * 4 months ago HOW TO USE A GUARD RING IN A PCB Guard rings in a PCB are used to assist in EMI reduction, and they can be easily drawn into a PCB layout with copper pour and vias. Read Article * Free Trial * 4 months ago CMOS NOISE MARGIN VALUES Power integrity and signal integrity design choices only work if they keep noise within the CMOS noise margin. Read Article * 5 months ago MATCHING THERMAL MEASUREMENTS TO SIMULATIONS Thermal simulations for electronics in an enclosure need boundary conditions and source definitions based on temperature measurements. Read Article * 6 months ago POWER SUPPLY CONTROL LOOP TRANSFER FUNCTION CONSTRUCTION Power supply control loop transfer function can be determined from the output impedance of the power supply Read Article * 3D Packaging vs 3D Integration Free eBook * 6 months ago HOW SELECTIVE HARMONIC ELIMINATION IS USED IN CIRCUITS Circuits with THD from fast switching pulses can restore signal quality with selective harmonic elimination. Read Article * 6 months ago EMBEDDED SYSTEMS WITH GENERATIVE AI WILL SOON BE REAL Embedded systems can leverage generative AI capabilities as long as a dataset is available and processors can support. Read Article * 6 months ago WHEN TO USE A LOOKUP TABLE IN A MICROCONTROLLER Micontrollers can store important data in a lookup table and use these for logical comparisons. Read Article * Evaluate Your RF/Microwave Design Needs Start Free Trial * 7 months ago THE CONCEPT OF PORTABILITY IN AI APPS AND HARDWARE AI has a portability problem, and that problem only gets bigger when you add custom hardware into the mix. Here’s how a modular hardware approach helps solve the problem. Read Article * about 2 months ago GROUP DELAY ENGINEERING IN RF FILTERS Signals that propagate through filters can experience varying group delay dispersion. Here's how it's engineered. Read Article * 7 months ago PHASE DELAY VS. GROUP DELAY: WHAT'S THE DIFFERENCE? Phase delay and group delay are two related concepts that arise in high-speed PCBs and RF systems. Read Article * 7 months ago WHAT SIMULATIONS ARE NEEDED FOR CHIP PACKAGING? Chip packaging evaluation can involve complex multiphysics simulations. Here are some of the main simulations needed in these systems. Read Article * 7 months ago HOW LONG DOES A TRACE TAPER OR TEARDROP NEED TO BE? Two types of routing connections to pads and vias are teardrops and tapers. Here’s how long these need to be to work properly. Read Article * 7 months ago 3 WAYS TO EXTRACT DUT S-PARAMETERS S-parameters for a DUT can be isolated with de-embedding, electrical delay, or port extension using your VNA. Read Article * Access eBook * 7 months ago WHAT COULD CAUSE A SOLDER JOINT TO CRACK? Solder joint cracking results from several possible causes, ranging from excess vibration to incorrect soldering of through-holes. Read Article * 3 months ago WHAT ASIC PACKAGE SIZE IS NEEDED TO GET PAST 224G? 224G PAM-4 differential pairs must operate in TEM propagation modes to ensure broadband signals can reach a PCB and other components. Read Article * 8 months ago WILL SKIP-LAYER ROUTING WORK PAST 56 GHZ? 224G PAM-4 systems use data rates that require 56 GHz Nyquist frequencies. Can skip-layer routing work in these component packages? Read Article * 8 months ago THREE ELECTRONICS COOLING OPTIONS IN YOUR ENCLOSURE Enclosures for a PCB assembly can help with thermal management by providing directed airflow and functioning as a large heat sink. Read Article * 9 months ago CONFIGURATION SIGNAL EDGE RATE AND FILTERING Configuration signals in an embedded system can connect to many different components. How fast do these signals need to be, and can you slow these down? Read Article * 9 months ago HOW ELECTRONIC DC LOADS WORK An electronic DC load is an essential piece of equipment for any lab. Learn about the operation of these units for power supply testing. Read Article * 9 months ago WORKING FLUIDS IN HEAT PIPES All heat pipes include a working fluid that is responsible for heat transfer away from a hot component. Read Article * Loading More... See more © Cadence Design Systems, Inc. Untitled Document A Great Place to Do Great Work! Seventh year on the FORTUNE 100 list Our Culture Join The Team * Products * Custom IC and RF * Digital Design and Signoff * IC Package * IP * PCB Design * System Analysis * Verification * All Products * Company * About Us * Events * Leadership Team * Investor Relations * Alliances * Careers * Cadence Academic Network * Media Center * Newsroom * Designed with Cadence * Blogs * Forums * Contact Us * General Inquiry * Customer Support * Media Relations * Global Office Locator © 2024 Cadence Design Systems, Inc. All Rights Reserved. Terms of Use Privacy Policy US Trademarks Do Not Sell My Personal Information Connect with us × ×