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 * Home
 * About
   
   Our Story In-house Facility Company Milestones Core Strengths Eco Commitment
   Certification
 * Services
   
   PCB Fabrication Process Product Range Laminates in Stock PCB Assembly
 * Products
   
   Products Material
 * Capabilities
   
   Rigid Rigid-Flex HDI
 * Order
   
   Order Prerequisites Contact

Maintaining 2-3 work shifts to ensure every piece of PCB/IC substrate ordered is
completed on time and as specified.

Backed by a pool of talented front-end and CAM engineers to provide the best
solutions for HDI or IC packaging projects.

With complete in-house production facility, including fully automated InCAM
system, AOI and other advanced equipment.

Operating round the clock to meet every single or multilayer board prototype
required by the customer.

Faster turnover rates offers the best alternative for electronic design or
manufacturing service companies working on tight deadlines.

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The Latest updated technologies and materials for 5G communication
device,aviation and military
(Up to Sept,2023)

 * PCB embedded coin technology for those designs need a high efficiency of
   thermal dissipation
 * Panasonic Megtron 6,7 and 8 for those Networking equipment s require an
   extremely low transmission loss for high Speed communication
 * Semiconductor testing boards Probe cards and Load boards with high pin counts
   with fine BGA pitch down to 0.15 mm. The closest distance between the rims of
   vias to circuitries is by 2.50 mils
 * Rigid-Flex Circuits layer buildups encompasses the asymmetrical
   1F3R,2F3R,3F7R and the symmetrical 2F4R,2F6R with blind/buried vias on the
   combination of Rigid-Flex circuits


UL REGISTERED

 * File number#E199875
 * File number#E484516


AS9100D


ISO9001


PROVIDING FASTEST PRODUCTION
TURNAROUND SOLUTION

Layer count Fastest turnaround time
(no. of working days) Order size
(sq-in) 2-6 2 up to 2000 8-12 3 up to 1500 14-18 4 up to 1000 20-above 5 up to
500


100% HDI-SBU IN-HOUSE PROCESS

 * 1.The copper surfaces are brown oxied.

 * 2.the laser drill holes created with the method of Direct Laser Drill.

 * 3.The conformal laser drill holes shapes are microsectioned and inspected
   with microscope (CY-930A).

 * 4.The Brown oxide (0.35-0.45 mil thick) are removed from the copper surfaces.

 * 5.The hydrocrabon residues on captures pads are removed by Plasma desmear.

 * 6.The surfaces of captures pads are examined by LaserVia AOIM(MACHVSION).

 * 7.Chemical desmear Alkaline permanganate cycle and panel plating are
   succeeded by Plasma Desmear.

 * 8.The laser drill holes at sequential build-up are plated shut by copper
   plating like 4+N+4 or (ALIVH).

BOARD GALLERY

CREDIT CARD

23/10/10


( TEL ) 886-3-451-8148 ext.281-289

( FAX ) 886-3-455-9570

sales@speedy-circuits.com.tw

No. 479, Zhongyuan Rd., Zhongli Dist., Taoyuan City 320021, Taiwan (R.O.C.)

Copyright © 2019 SPEEDY-CIRCUITS All Rights Reserved

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