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CUSTOMER NEWSLETTER, APRIL 2022 CUSTOMER NEWSLETTER,
APRIL 2022

 * Executive Forum
 * Cover Story
 * Quarterly Updates


NEW NORM, NEW COLLABORATION, NEW INNOVATION

Paul de Bot, General Manager, TSMC Europe

As the world prepares to emerge from the pandemic, the digital transformation
that we have experienced in the past few years shows every sign of continuing,
and even accelerating. That makes semiconductor products even more important
across all industries, driven by increasing silicon content in everything from
automotive to IoT applications, in addition to data centers, smartphones, and
HPC-related applications. As we are entering a period of higher structural
growth driven by the multi-year megatrends of 5G and HPC, our capital spending
for 2022 will be between US$40 and US$44 billion, up from a previous record of
US$30 billion in 2021, to help customers accelerate innovation with reliable
capacity and leading technologies that are constantly developed at a predictable
pace.

To address the growing challenges faced by IC designers, we have focused our R&D
efforts on offering customers differentiated, leading-edge technologies and
design solutions that contribute to their product success and business growth.
Our 5nm technology enters its third year of ramp and has proven to be the
industry’s most competitive leading-edge technology. To further improve our 5nm
family’s performance, power, and density for next-wave 5nm products, we
introduced the N4P and N4X technologies. TSMC N4P offers 11% performance boost
as compared to our N5 process, with 22% improvement in power efficiency and 6%
density gain. Our N4P is designed for easy migration from N5 with product
tape-outs scheduled for second half of 2022. We also introduced N4X as an
offering especially optimized for workload-intensive HPC applications. Our N4X
will offer much more circuit performance boost over the N5 process and we expect
it to enter risk production in first half of 2023.

Our N3 technology development is on track and we have developed complete
platform support for both HPC and smartphone applications. Our N3 volume
production will start in second half of 2022, with good yield. We continue to
see a high level of customer engagement at N3 and expect more new tape-outs for
the first year of N3 as compared with N5 and N7. We also introduced N3E to
further extend our 3nm family with enhanced performance, power, and yield. We
have observed a high level of customer engagement at N3E, and its volume
production is scheduled for one year after N3. Our 3nm technology will be the
most advanced foundry technology in both PPA and transistor technology when it
is introduced.

TSMC’s strategy at mature nodes is to develop specialty technology solutions to
meet customer requirements and create differentiated and long-lasting value to
customers. We are expanding our 28nm manufacturing capacity at sites in Mainland
China, Japan, and Taiwan. We believe the expansion of our mature node capacity
will enable us to better serve our customers’ needs. Our differentiated
specialty technology will enable our customers to capture the demand generated
from industry megatrends and achieve business growth.

Our investments on capacity increase and technology advancement have led to an
expansion of our global manufacturing footprint, with a leading-edge fab under
construction in Arizona, and a specialty technology fab preparing to break
ground in Kumamoto, Japan. These expansions will not only help us fulfill
customer needs, but also help us to attract top global talent. We are looking
forward to embracing new colleagues from around the world and hope to generate
new energy from their enthusiasm, talent, and fresh perspectives to support our
customer’s success.

As we begin moving safely back to more normal routines with new vaccines and
therapeutics under development, closer collaboration across the industry is
poised to drive innovation and the global economy racing forward. We’re looking
forward to meeting each of you at our annual Technology Symposium in June, where
we can discuss about how to accelerate semiconductor innovation and make a
greater success with a collaborative power of TSMC, our ecosystem partners and
customers.

Today, the transformation of the semiconductor industry requires us to adopt a
new mindset, and to be ready to cast aside old assumptions. What will never
change are our core values of Integrity, Commitment, Innovation, and Customer
Trust, which have guided us through the challenges of the past 35 years and to
become your trusted technology and capacity provider. Looking towards the growth
opportunities before us, we are honored that each of you have chosen to partner
with us on this innovation journey and thrilled for the future.

Menu

 * Executive Forum
 * Cover Story
 * Quarterly Updates

Cover Story

TSMC: ENABLING STARTUPS TO UNLEASH NEW SEMICONDUCTOR INNOVATION

Startups have driven semiconductor innovation from the very beginnings of the
tech industry. Their disruptive innovations are the dynamo that drives the
semiconductor industry development in the United States and around the world. As
their trusted technology and capacity provider, TSMC has been working with a
diverse array of startups across the industry, providing access to its leading
technologies and manufacturing capacity to help them grow and thrive. Read more
+

Quarterly Updates

The latest news, videos and top stories about TSMC and the semiconductor
industry! Keep updated with TSMC’s technology and solutions development
progress, partnership achievements, customer success and corporate initiatives.
Read more +

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