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EVENT COVERAGE


A RETROSPECTIVE: A SUCCESSFUL 9TH ESTC 2022

Jan 05, 2023


The Electronics System-Integration Technology Conference (ESTC) is the premier
international...



MOORE’S LAW, ALIVE OR DEAD? WE’RE LEARNING MORE AT IEDM 2022

Dec 07, 2022


Over the past 10ish years, there has been a great...



SEMICON EUROPA 2022 MEMBER PREVIEW

Nov 09, 2022


SEMICON Europa kicks off next week as microelectronics experts and...



UPCOMING EVENTS


34TH ANNUAL ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE

May 1, 2023


WOMEN IN SEMICONDUCTORS - WIS 2023

May 1, 2023


2023 CEO OUTLOOK MAY 18

May 18, 2023


JOB OPENINGS


HAS OUR INDUSTRY BECOME MORE SUSTAINABLE?

Apr 18, 2023 · By Julia Goldstein · Blogs, From Different Dimensions


IFTLE 554: ARE TMD MATERIALS THE FUTURE OF THE TRANSISTOR?

Apr 20, 2023 · By Phil Garrou · Blogs, Packaging IFTLE


THIS. IS. COMMUNITY: THE 3D INCITES DEI FUND GROWS TO $61,672.52

Apr 19, 2023 · By Francoise von Trapp · 3D In Context, Blogs


HAS OUR INDUSTRY BECOME MORE SUSTAINABLE?

Apr 18, 2023 · By Julia Goldstein · Blogs, From Different Dimensions


IFTLE 554: ARE TMD MATERIALS THE FUTURE OF THE TRANSISTOR?

Apr 20, 2023 · By Phil Garrou · Blogs, Packaging IFTLE



TOP STORIES


DID THE SVB FAILURE LAUNCH ANOTHER HIGH-TECH FINANCIAL CRISIS?

Apr 13, 2023


As Silicon Valley Bank (SVB) and Signature Bank failures were...



EXCITEMENT OVER CHIPLETS: NOT FOR EVERYONE AND NOT TRIVIAL FOR TEST

Apr 12, 2023


Live from “Silicon Desert”: The news is all about huge...



DIGITAL AND PHYSICAL: THERMAL TWINS FOR DEVELOPING THERMAL MANAGEMENT SOLUTIONS

Apr 10, 2023


As we all know, finding thermal management solutions is becoming...



IFTLE 553: SAMSUNG FOUNDRY UPDATE; AMKOR/ GLOBALFOUNDRIES VENTURE

Apr 05, 2023


Samsung Foundry Forum Moonsoo Kang, Head of Business Development at...



CREATING A SEMICONDUCTOR WORKFORCE FOR THE FUTURE

Apr 04, 2023


There are multiple challenges facing the semiconductor industry as multiple...



THE IMPORTANCE OF SMART DATA SOLUTIONS

Apr 03, 2023


Today, semiconductor manufacturers face more challenges with their data as...



VIDEO OF THE WEEK


ANEMOI THERMAL SOLVER FOR CHIPLET AND MULTI-CHIP ASSEMBLIES

Apr 20, 2023


PODCAST OF THE WEEK




DEI: IT TAKES A VILLAGE – A PANEL DISCUSSION




WHITEPAPERS


THIN GLASS: A SIMPLIFIED PATH TO COPPER-FILLED THROUGH-GLASS VIAS

Nov 15, 2022


Glass is a compelling substrate for interposer and advanced packaging...



RECOMMENDED READS


PURDUE CONVENES CHIPS SUMMIT IN D.C. WITH SEC. RAIMONDO AND SEN. YOUNG –
SEMICONDUCTOR DIGEST

Apr 20, 2023


Leaders from industry, government and academia convened at a summit...



HOW CHIP ENGINEERS PLAN TO USE AI – SEMIENGINEERING

Apr 20, 2023


Checks, balances, and unknowns for AI/ML in semiconductor design. The...



COMMUNITY NEWS


PROMEX BOLSTERS LEADERSHIP TEAM WITH DAVID FROMM AS VICE PRESIDENT OF
ENGINEERING

Apr 19, 2023


SANTA CLARA, Calif., Feb. 7, 2022 – Promex Industries, a Silicon Valley-based...



BREAKING THE LIMITS: STRATEDGE PUSHES HIGH-TEMPERATURE PACKAGING TECHNOLOGY TO
THE EXTREME AT UPCOMING EVENTS

Apr 17, 2023


Santee, Calif. – 14 April 2023 – StratEdge Corporation, leader in the...



IMAPS ADVANCED SIP CONFERENCE IS NOW CHIPCON

Apr 13, 2023


The top global event for Chiplet and Heterogeneous Integration Packaging...



TRENDING TOPIC


#ADVANCED PACKAGING MATERIALS VIEW ALL


INTERCONNECT RELIABILITY: FROM THE CHIP TO THE SYSTEM

Dec 13, 2022 · By Dr. Dongkai Shangguan · 3D In-Depth

Interconnect reliability is critical to the reliability of semiconductor
packaging and electronic systems. If we look at the life cycle...



IFTLE 538: KYOCERA DETAILS HDBU AND HDI PROCESSING AND LOOKS AT US ON-SHORING  

Oct 31, 2022 · By Phil Garrou · Blogs

As we noted in IFTLE 537, prior to the 2022 IMAPS conference in Boston earlier
this month, IMAPS hosted a...



CROSS-DISCIPLINARY EXPERIENCE IS KEY TO INTERN SUCCESS

Oct 18, 2022 · By Audra Koch · Blogs

As a graduate student in computer science, I was excited to learn about a
machine learning internship at Brewer Science....



MATERIALS SCIENCE SOLUTIONS FOR ELECTRONICS SUSTAINABILITY

Sep 15, 2022 · By Dr. Dongkai Shangguan · 3D In-Depth

This summer, the temperature reached 111°F in Silicon Valley, where I live. This
historical record unmistakably brought home the “inconvenient...



SUSTAINABILITY 101: ARE YOUR PRODUCTS TOXIC?

May 16, 2022 · By Julia Goldstein · Blogs

Do you know how many individual elements and chemical compounds are required to
make a circuit board? I don’t. There...



DEVELOPMENT OF INNOVATIVE ADVANCED PACKAGING MATERIALS FOR SYSTEM IN PACKAGE

May 12, 2022 · By Dr. Dongkai Shangguan · 3D In-Depth

Advanced packaging has continued to evolve with various interconnect
technologies on their way towards heterogeneous integration. Different assembly
processes are...



IFTLE 497: AJINOMOTO EXPANDS MATERIALS OFFERINGS; BESI READIES FOR CHIPLET ERA

Sep 22, 2021 · By Phil Garrou · Blogs

Continuing our look at presentations from the IMAPS SiP Conference. Ajinomoto
Habib Hichri of Ajinomoto discussed the use of novel...



IFTLE 479: ABF SUBSTRATE SHORTAGES; CONSOLIDATION CONTINUES

Mar 11, 2021 · By Phil Garrou · Blogs

This past fall, our packaging industry saw significant shortages of packaging
substrates made from Ajinomoto Build-up Film (ABF). Let’s take...



IFTLE 467: MORE HIGHLIGHTS OF IMAPS 2020

Nov 16, 2020 · By Phil Garrou · Uncategorized

Avi Bar Cohen 1946 – 2020 Before we take a look at some interesting papers from
the recent IMAPS 2020...



TEMPORARY BONDING AND MOLD PROCESS TO ENABLE NEXT-GEN FOWLP

Apr 30, 2020 · By Arnita Podpod · 3D In-Depth

Temporary wafer bonding processes were initially developed for enabling
three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can
be...



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Francoise von Trapp Phil Garrou Herb Reiter Dean Freeman Paul Werbaneth Trine
Pierik Jean-Christophe ELOY Julia Goldstein Andrew Walker


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SITEMAP

 * 3D In-Depth
    * What is 3D Integration?
    * Design
    * Devices
    * Manufacturing
    * Materials
    * Processes and Technology
    * Test and Inspection

 * Community
    * News
    * Awards
    * White Papers
    * Book Reviews

 * Blogs
    * Francoise in 3D
    * Packaging IFTLE
    * 3D In Context
    * From Different Dimensions
    * SemiSisters

 * Events
    * Calendar
    * 3D Event Coverage


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