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Neil Tyler
15 Nov 2024

More in

ASIC & SOC

AUTOMOTIVE

ELECTRONICS

TECHNOLOGY




FIRST AUTOMOTIVE MULTI-DOMAIN SOC BUILT WITH 3NM PROCESS TECHNOLOGY

News
3 mins read

Renesas Electronics has announced a new generation of automotive fusion
system-on-chips (SoCs) that will serve multiple automotive domains.


Credit: Renesas

These will include Advanced Driver Assistance Systems (ADAS), in-vehicle
infotainment (IVI), and gateway applications on a single-chip that’s been built
using the latest 3-nanometre automotive process technology from TSMC.

The R-Car X5H SoC is the first device in the R-Car X5 series and offer an
improved level of integration and performance that will allow OEMs and Tier 1s
to shift to centralised Electronic Control Units (ECUs) for streamlined
development and future-proof system solutions.

According to Renesas, the R-Car X5H is among the first in the industry to offer
highly integrated, secure processing solutions on a single chip for multiple
automotive domains, thanks to its hardware-based isolation technology.
Additionally, the SoC offers the option to expand AI and graphics processing
performance using chiplet technology.

The R-Car X5H directly addresses the growing complexity of Software-Defined
Vehicle (SDV) development where the challenges include optimising compute
performance, power consumption, cost, hardware and software integration – while
ensuring vehicle safety.

By tightly coupling application processing, real-time processing, GPU and AI
compute, large display capabilities, and sensor connectivity on a single chip,
these devices will, according to Renesas, enable a new class of automated
driving, IVI and gateway applications.

The SoC series enables AI acceleration of up to 400 TOPS, and GPU processing of
up to 4 TFLOPS. It incorporates a total of 32 Arm Cortex-A720AE CPU cores for
application processing, delivering over 1,000K DMIPS performance; and six Arm
Cortex-R52 dual lockstep CPU cores delivering over 60K DMIPS performance with
support for ASIL D capabilities without external microcontrollers (MCUs).

Manufactured using one of TSMC’s most advanced process nodes, the SoC series
achieves both top-end CPU performance and a 30-35 percent reduction in power
consumption when compared to devices designed for a 5-nm process node.

While the R-Car Gen 5 SoCs come with powerful native NPU and GPU processing
engines, Renesas is also offering customers the ability to scale up their
performance through chiplet extensions.

When combining a 400-TOPS on-chip NPU with an external NPU via a chiplet
extension, for example, it’s possible to scale their AI processing performance
by three to four times or more. To enable chiplet integration, the R-Car X5H
offers the standard UCle (Universal Chiplet Interconnect Express) die-to-die
interconnect and APIs, supporting interoperability with other components in a
multi-die system, even if they are non-Renesas chips.

This flexible design approach allows car OEMs and Tier 1s to mix and match
different functions and customise their systems including future upgrades across
vehicle platforms.

Safety remains a number one priority and while other SoCs rely solely on
software-based isolation, the R-Car X5H SoC also offers hardware-based Freedom
from Interference (FFI) technology. This hardware design implementation securely
isolates safety-critical functions, such as brake-by-wire, from non-critical
functions.

Functions deemed safety critical can be assigned their own separate, redundant
domains, each having its own independent CPU core, memory and interfaces, so
preventing potentially catastrophic vehicle failures in the event of a hardware
or software fault from a different domain. The R-Car X5H also comes with Quality
of Service (QoS) management that determines workload priorities and assigns
processing resources in real time. 

“Our latest innovations in the R-Car Gen 5 platform tackle the complex
challenges the automotive industry faces today,” said Vivek Bhan, Senior Vice
President and General Manager of High-Performance Computing at Renesas. “Our
customers are looking for end-to-end automotive-grade system solutions that
cover everything from hardware optimisation, safety compliance to flexible and
scalable architecture selection and seamless tools and software integration. Our
R-Car Gen 5 Family meets these demands, and we are committed to helping the
industry accelerate SDV development and Shift-Left innovations for the next era
of automotive technology.” 

Renesas’ latest R-Car X5H and all future Gen 5 products are designed to
accelerate SDV development by combining hardware and software into a
comprehensive development platform. The newly launched R-Car Open Access (RoX)
SDV platform integrates all essential hardware, operating systems (OS), software
and tools needed for automotive developers to rapidly develop next-generation
vehicles with secure and continuous software updates.

RoX provides OEMs and Tier-1 suppliers the flexibility to virtually design a
broad range of scalable compute solutions for ADAS, IVI, gateway, and
cross-domain fusion systems as well as body control, domain, and zone control
systems.

The R-Car X5H will be sampling to select automotive customers in 1H/2025, with
production scheduled in 2H 2027.

ASIC & SoC
Automotive
Electronics
http://www.renesas.com

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