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Forgot Password | Site Login Go to main content Menu ® Global Standards for the Microelectronics Industry MAIN MENU * Standards & Documents * Search Standards & Documents * Recently Published Documents * Technology Focus Areas * Main Memory: DDR4 & DDR5 * Mobile Memory: LPDDR, Wide I/O * Flash Memory: SSDs, UFS, e.MMC, XFMD * Memory Configurations: JESD21-C * Memory Module Design File Registrations * Wide Bandgap Power Semiconductors: GaN, SiC * Registered Outlines: JEP95 * JEP30: Part Model Guidelines * ESD: Electrostatic Discharge * Lead-Free Manufacturing * Type Registration, Data Sheets * Order JEDEC Standard Manufacturer's ID Code * Order ID Code for Low Power Memories * Copyright Information * Document Translation * About JEDEC Standards * Committees * All Committees * JC-11: Mechanical Standardization * JC-13: Government Liaison * JC-14: Quality and Reliability of Solid State Products * JC-15: Thermal Characterization Techniques for Semiconductor Packages * JC-16: Interface Technology * JC-40: Digital Logic * JC-42: Solid State Memories * JC-45: DRAM Modules * JC-63: Multiple Chip Packages * JC-64: Embedded Memory Storage & Removable Memory Cards * JC-70: Wide Bandgap Power Electronic Conversion Semiconductors * News * News * JEDEC Awards: 2024 Honorees * JEDEC Awards: Distinguished Members Recognition * In Memoriam * JEDEC Quality & Reliability Task Group in China * Media Kit * Events & Meetings * All Events & Meetings * JEDEC DDR5 Workshop: Recordings for Sale * Mobile/Client/AI Computing Forum * Server/Cloud Computing/Edge Forum * Join * Apply for Membership * Membership Benefits * Membership Dues & Details * About * Overview * Member List * Board of Directors * Committee Chairs * Industry Collaboration * Policies & Governance * Patent Policy * JEDEC History * Pre-1960s * 1960s * 1970s * 1980s * 1990s * 2000s * 2010s * Contact * RSS Feeds * JEDEC Staff * Website Help * Year in Review: 2023 * Login required Members Area MAIN MENU * Standards & Documents * Search Standards & Documents * Recently Published Documents * Technology Focus Areas * Main Memory: DDR4 & DDR5 * Mobile Memory: LPDDR, Wide I/O * Flash Memory: SSDs, UFS, e.MMC, XFMD * Memory Configurations: JESD21-C * Memory Module Design File Registrations * Wide Bandgap Power Semiconductors: GaN, SiC * Registered Outlines: JEP95 * JEP30: Part Model Guidelines * ESD: Electrostatic Discharge * Lead-Free Manufacturing * Type Registration, Data Sheets * Order JEDEC Standard Manufacturer's ID Code * Order ID Code for Low Power Memories * Copyright Information * Document Translation * About JEDEC Standards * Committees * All Committees * JC-11: Mechanical Standardization * JC-13: Government Liaison * JC-14: Quality and Reliability of Solid State Products * JC-15: Thermal Characterization Techniques for Semiconductor Packages * JC-16: Interface Technology * JC-40: Digital Logic * JC-42: Solid State Memories * JC-45: DRAM Modules * JC-63: Multiple Chip Packages * JC-64: Embedded Memory Storage & Removable Memory Cards * JC-70: Wide Bandgap Power Electronic Conversion Semiconductors * News * News * JEDEC Awards: 2024 Honorees * JEDEC Awards: Distinguished Members Recognition * In Memoriam * JEDEC Quality & Reliability Task Group in China * Media Kit * Events & Meetings * All Events & Meetings * JEDEC DDR5 Workshop: Recordings for Sale * Mobile/Client/AI Computing Forum * Server/Cloud Computing/Edge Forum * Join * Apply for Membership * Membership Benefits * Membership Dues & Details * About * Overview * Member List * Board of Directors * Committee Chairs * Industry Collaboration * Policies & Governance * Patent Policy * JEDEC History * Pre-1960s * 1960s * 1970s * 1980s * 1990s * 2000s * 2010s * Contact * RSS Feeds * JEDEC Staff * Website Help * Year in Review: 2023 * Login required Members Area HOME SEARCH & DOWNLOAD JEDEC DOCUMENTS Search by keyword or document number. Search: or Browse by Keyword » -------------------------------------------------------------------------------- TECHNOLOGY FOCUS AREAS For over 50 years, JEDEC has been the global leader in developing open standards and publications for the microelectronics industry. JEDEC committees provide industry leadership in developing standards for a broad range of technologies. Current areas of focus include: * Main Memory: DDR4 & DDR5 SDRAM * Flash Memory: UFS, e.MMC, SSD, XFMD * Mobile Memory: LPDDR, Wide I/O * Memory Module Design File Registrations * Memory Configurations: JESD21-C * Registered Outlines: JEP95 * JEP30: PartModel Guidelines * Lead-Free Manufacturing * ESD: Electrostatic Discharge * Wide Bandgap Power Semiconductors COMMITTEE MEETINGS JC-14.2 & JC-14.7 19 Apr 2024 Board of Directors 7 May 2024 JC-13 13 - 16 May 2024 JC-14 15 - 16 May 2024 JC-13 20 - 23 May 2024 JC-16,40,42,45,63,64 3 - 6 Jun 2024 JC-15 4 Jun 2024 JC-11 5 - 6 Jun 2024 See more meetings » COMMITTEE MEETINGS JC-14.2 & JC-14.7 19 Apr 2024 Board of Directors 7 May 2024 JC-13 13 - 16 May 2024 JC-14 15 - 16 May 2024 JC-13 20 - 23 May 2024 JC-16,40,42,45,63,64 3 - 6 Jun 2024 JC-15 4 Jun 2024 JC-11 5 - 6 Jun 2024 See more meetings » EVENTS Mobile/Client/AI Computing Forum 14 May 2024 Server/Cloud Computing/Edge Forum 15 May 2024 See more upcoming events » REGISTER TODAY 5/14: Mobile/Client/AI Computing 5/15: Server/Cloud Computing/Edge Join us in San Jose, CA this May. From mobile and client computing to AI, servers, cloud computing and edge technologies, there’s something for everyone looking to stay ahead in this dynamic field. Attendance is free of charge, and registration is required. Space is limited. More » SIGN UP FOR JEDEC SMARTBRIEF The latest industry news delivered right to your inbox - Free! » RECENT PRESS RELEASES JEDEC Plans to Update Popular Standard for Low Power Memory JEDEC Publishes GDDR7 Graphics Memory Standard Intel CEO Pat Gelsinger Receives 2024 Distinguished Executive Leadership Award from JEDEC Board Subscribe to JEDEC RSS Feeds » * Terms & Conditions * Privacy Policy * Contact Us * Refund Policy * Website Help * Login Copyright © 2024 JEDEC. All Rights Reserved. USER LOGIN Username * Password * Cancel