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XCEDE® BACKPLANE CONNECTORS

85Ω and 100Ω solutions to meet a wide variety
of application needs, including Ethernet and PCI
Preferred Parts are now available through key distributors

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Automotive Grade PCIe® M.2 Gen 4 Card Edge Connectors
Amphenol's PCIe® M.2 Gen 4 connectors provide 67 contacts on 0.50mm pitch and
signal transmission speed of 16Gb/s. It is designed for PCIe® 4.0, USB 3.0/3.1
and SATA 3.0 applications, and USCAR compliant, making it suitable for
automotive applications.

BarKlip® BK450 Connector
Amphenol's BarKlip® BK450 connector is designed to mate directly with a 3.18mm
single pole busbar and provides a convenient method of distributing up to 450A
between busbars. The connector system features 36 independent points of
gold-plated contact beams ensuring high current carrying capability and low
contact resistance.

Minitek MicroSpace™ High Voltage selective loaded Crimp-to-Wire Connector
Platform
Minitek MicroSpace™ High Voltage selective loaded Crimp-to-Wire connector
platform's unique design enables LV214 Severity-2 and performs at 3.81mm,
6.35mm, and 8.89mm pitch with 400V, 800V and 1200V.

SK Series - Sockets
Amphenol's patented compression mount contact technology utilizes
industry-leading alloys to make cost effective and electrically robust socket
solutions that offer high performance. With designs supporting pitches down to
0.4mm and speeds up to 40GHz, the SK series sockets are being used in cutting
edge BGA, LGA and other small form factor IC applications.

Single Pair Ethernet (SPE) IP67 Circular Push-Pull Connectors and Cables
Single Pair Ethernet (SPE) connectors for Industrial applications bring direct
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system cameras that operate at speeds up to 1Gb/s. SPE eliminates slow expensive
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existing and new industrial network systems.

Minitek® MicroSpeed 1.00mm Board-to-Board Connector
FCI Basics Minitek® MicroSpeed connector family with 1.00mm pitch supports
high-speed data applications with up to 25Gb/s. These connectors feature a
shielded design that provides superior EMC performance and significantly
improved electromagnetic compatibility. The poka-yoke polarization prevents
visual mismating, which makes it ideal for use in industrial environments.

XCede® HD2
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While
maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this
connector provides developers with a readily available robust solution for
tighter card pitches and chassis designs where space requirements and density
are critical.

Paladin® 112Gb/s Backplane Cable
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product
business, dedicated to developing and manufacturing cabled backplane solutions
for next generation system architectures. Our customers are leading providers of
datacenter switches and routers, enterprise servers and high performance
computers.



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Connect Blog
LEARN MORE
Amphenol’s Connectivity Solutions for AI and ML
Artificial Intelligence (AI) is the talk of the town today. Thousands of people
sign up every day on ChatGPT, an AI chatbot developed by OpenAi. This is
significant proof of how receptive we humans are to any tech that can improve
our efficiency and productivity.
LEARN MORE
Why Slim 28-AWG CAT6a UTP Network Patch Cables are Perfect for High-Density Data
Centers?
As technology advances, high-density data centers are becoming more common. With
more devices being connected to the internet than ever before, it's essential to
have a reliable and efficient network in place.
LEARN MORE
The Fastest Path to Wireless Charging with Amphenol and NuCurrent
Shanghai Amphenol Airwave Communication Electronics Co., Ltd, a subsidiary of
Amphenol Corporation has partnered with NuCurrent, a global player in wireless
power systems. This partnership will address the need to shift toward new
standards such as Qi2 (pronounced “cheē tü”) standard.
 * INDUSTRY TRENDS
   Flexible Printed Circuit Assembly
   Flexible option for space constraint environments where PCBs are not an
   option
   

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Plating

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support the growth of Information, Communications and Commercial electronics
markets, particularly in plating, signal integrity performance, and power
management.

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