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Submitted URL: http://www.berg.com/
Effective URL: https://www.amphenol-cs.com/
Submission: On March 02 via api from US — Scanned from DE

Form analysis 3 forms found in the DOM

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   Busbar I/O
   Card Edge
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   D-Subminiature
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   Modular & Magnetic Jack
   Commercial Rugged Harsh I/O
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OPEN COMPUTE PROJECT
INTERCONNECT SOLUTIONS

Amphenol provides high-speed connectors, card edge connectors, power busbar
connectors,
and cable solutions for many OCP projects, allowing for standardized solutions
and simple
system designs.



EXPLORE NOW

 * New Products
 * Focus Products

DuraEV™
DuraEV™ is a standard connector solution offered with 2 power and 4/6 signal
pins which employs a patented contact system that is capable of carrying a
continuous current from 15A up to 70A with 10,000 mating cycles.

BergStak® 0.635mm Connector
BergStak® 0.635mm pitch is a compact board-to-board connector with low stack
height of 3.00mm. Available in 80 and 140 positions it support applications
which require high pin counts and low profile connection.

PwrMAX® I/O Cable Connector System
PwrMAX® I/O is the highest density power and signal cable connector available.
It is capable of carrying up to 50A/Contact (100A/column) with 12 adjacent
contacts powered. A range of 6AWG - 8AWG wire options are available for power
contacts and 22AWG for signal contacts.

ExtremePort™ QSFP 112G
Amphenol's ExtremePort™ QSFP 112G interconnect system is comprised of a
38-position, 0.8mm pitch connector built for use in high speed serial
applications. Each port offers 4 channels which increases port density, frees up
board real estate and delivers a cost optimized solution. The ExtremePort™ QSFP
112G connector supports next generation 400G applications and transmits up to
112Gb/s PAM4 per channel.

BarKlip® BK200 I/O for EV Charging
Amphenol's BarKlip® BK200 I/O provides a convenient method of distributing up to
200A between busbars, cables and circuit boards. It features 14 fully
independent cantilevered beams, providing a true compliant spring to adjust for
variations in busbar alignment and surface finish. The ultrasonically welded
connection between the wire and contact increases the efficiency and reliability
of current transition.

Single Pair Ethernet (SPE) IP67 Circular Push-Pull Connectors and Cables
Single Pair Ethernet (SPE) connectors for Industrial applications bring direct
Ethernet connectivity to peripheral devices like sensors, actuators, and vision
system cameras that operate at speeds up to 1Gb/s. SPE eliminates slow expensive
and complex fieldbus protocols and connections by simplifying and standardizing
existing and new industrial network systems.

QSFP DD Cable Assemblies
Amphenol's QSFP DD (Double Density) passive copper cable assemblies double the
number of channels from 4 to 8 lanes when compared to the existing 100G QSFP
cabling systems, enabling more bandwidth within the same mechanical envelope.
Compatible with 25G/Lane NRZ up to 112G/Lane PAM4 signaling protocols that allow
cables to deliver aggregate bandwidths of 200G, 400G, and 800G per cable
assembly. Available in both Passive, Active and Loopback variants.

OSFP OverPass™ Assemblies
OSFP OverPass™ products remove high speed signaling from the PCB and create an
eight channel direct lower loss interconnection between the ASIC site and the
external OSFP IO port by overpassing the PCB. This helps to enable 56G and 112G
hardware system designs and a technology for future 224G systems. Using these
solutions results in lower over signal loss, less PCB design complexity and
reduces PCB costs. Fully compatible with OSFP industry standards and with both
high speed and sideband signal requirements.



 * ARTIFICIAL INTELLIGENCE MACHINE LEARNING
   
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Connect Blog
Learn More
Meet Amphenol at OFC 2023
OFC is the most comprehensive and largest conference and exhibition for optical
communications and networking. It is the go-to place to visit and interact with
hundreds of manufacturers on their latest products and innovative solutions and
to understand on the trends that drive the market.
Learn More
Join Amphenol at Automotive World 2023
Automotive World is a leading global exhibition in automotive electronics,
covering technologies like connected cars, autonomous driving, EV/HV/FCV, and
MaaS. This year, 2023, the event will be held at Tokyo, Japan. Both Automotive
OEMs and Tier 1 suppliers are among the 1,420 exhibitors, 70K visitors, and 170
speakers expected to attend the event.
Learn More
Amphenol product demonstrations at DesignCon 2023
DesignCon, the largest event for Chip, Board, and Systems Design Engineers, is a
three-day engineering event showcasing advanced designs, modern technology
updates, and unparalleled networking opportunities for high-speed communications
and semiconductor communities.
 * INDUSTRY TRENDS
   PCIe® Gen 6 High Speed Interconnect Solutions
   PCIe 6.0 doubles bandwidth and power efficiency over PCIe 5.0 (32 GT/s),
   while meeting industry demand for high-speed, low-latency interconnects. Data
   Center, AI/ML, HPC, Automotive, IoT, and Military/Aerospace markets benefit
   from PCIe 6.0 technology’s cost-effective and scalable interconnect solution.
   

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VIDEO HIGHLIGHTS



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CUSTOM INTERCONNECT SOLUTIONS, GLOBAL MANUFACTURING FOOTPRINT



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Amphenol CS brings a broad array of innovative technology and solutions to
support the growth of Information, Communications and Commercial electronics
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