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 * WelQuickTM: Quickly Bonding Film of Dissimilar Materials
 * SKYVEHEATSINKTM
 * High Thermal Conductive and moisture resistance AlN Filler
 * Almic-CanTM: Aluminum/Plastic Composite Food Containers
 * VGCFTM-H: Conductive additive for cathode/anode of LIB
 * Battery Cell
 * Power Module

Contact us

SDK Innovation Infinity

 * New Technology Insights
   WelQuickTM: Quickly Bonding Film of Dissimilar Materials
   Strong bonding of dissimilar materials can be achieved quickly by welded
   film, which applies to a diverse range of adhesion needs.
   Al-Plastic direct-bonding
   SDK finally achieved direct-bonding of metal with thermoplastic and
   thermosetting resins.
   SKYVEHEATSINKTM
   Ideal thermal management solution for 5G network devices! By reducing fin
   thickness and pitch to levels difficult to achieve with extruded heatsinks,
   greater compactness and lighter weight can be achieved without undermining
   the heat dissipation performan
   High Thermal Conductive and Moisture Resistance AlN Filler
   New thermal conductive filler with high thermal conductivity, insulation
   reliability and moisture resistance.
   Almic-CanTM: Aluminum/Plastic Composite Food Containers
   Almic-CanTM: Aluminum/plastic-composite food containers that offer
   high-barrier and easy-opening properties, are easily decorated, contribute to
   reducing food waste, and provide safe and secure food.
   VGCFTM-H: Conductive additive for cathode/anode of LIB
   With a small amount of VGCFTM-H, LIB’s rate properties and high/low
   temperature performance improve and LIB’s life extends.
   Laminate film cooler
   Light weight and thin design battery cooler using laminate film
   Heat-Resistant Coating Binder　PNVATM GE191 Series
   PNVATM realizes high heat resistant and thin ceramic coating layer for LIB
   separators, improving safety and energy density of LIBs.
   Silver Nanowire Transparent Conducting Film
   SDK's Silver Nanowire Transparent Conducting Film has flexibility, low
   resistivity, and high transparency.
 * R&D story
   Silver Nanowire Transparent Conducting Film (AgNW-TCF)
   More freedom on design of touch-panel !
   Al-Plastic direct-bonding
   Solution for multi-material bonding !
   Laminate film cooler
   Flexible allocation in your automotive interior
   Heat-Resistant Coating Binder PNVATM GE191 Series
   Make LIBs safer !
 * Multi Material Solutions
   
   Battery Cell
   
   Leaflet Online Video
   
   Power Module
   
   Leaflet Online Video

JA



e-mail
newsletter

Contact us

Download PDF

 * WelQuickTM: Quickly Bonding Film of Dissimilar Materials
 * SKYVEHEATSINKTM
 * High Thermal Conductive and moisture resistance AlN Filler
 * Almic-CanTM: Aluminum/Plastic Composite Food Containers
 * VGCFTM-H: Conductive additive for cathode/anode of LIB
 * Battery Cell
 * Power Module

New Technology Insights

 * Strong bonding of dissimilar materials can be achieved quickly by welded
   film, which applies to a diverse range of adhesion needs. WelQuickTM: Quickly
   Bonding Film of Dissimilar Materials
 * SDK finally achieved direct-bonding of metal with thermoplastic and
   thermosetting resins. Al-Plastic direct-bonding
 * Ideal thermal management solution for 5G network devices! By reducing fin
   thickness and pitch to levels difficult to achieve with extruded heatsinks,
   greater compactness and lighter weight can be achieved without undermining
   the heat dissipation performan SKYVEHEATSINKTM
 * New thermal conductive filler with high thermal conductivity, insulation
   reliability and moisture resistance. High Thermal Conductive and Moisture
   Resistance AlN Filler
 * Almic-CanTM: Aluminum/plastic-composite food containers that offer
   high-barrier and easy-opening properties, are easily decorated, contribute to
   reducing food waste, and provide safe and secure food. Almic-CanTM:
   Aluminum/Plastic Composite Food Containers
 * With a small amount of VGCFTM-H, LIB’s rate properties and high/low
   temperature performance improve and LIB’s life extends. VGCFTM-H: Conductive
   additive for cathode/anode of LIB
 * Light weight and thin design battery cooler using laminate film Laminate film
   cooler
 * PNVATM realizes high heat resistant and thin ceramic coating layer for LIB
   separators, improving safety and energy density of LIBs. Heat-Resistant
   Coating Binder　PNVATM GE191 Series
 * SDK's Silver Nanowire Transparent Conducting Film has flexibility, low
   resistivity, and high transparency. Silver Nanowire Transparent Conducting
   Film

R&D story

 * More freedom on design of touch-panel ! Silver Nanowire Transparent
   Conducting Film (AgNW-TCF)
 * Solution for multi-material bonding ! Al-Plastic direct-bonding
 * Flexible allocation in your automotive interior Laminate film cooler
 * Make LIBs safer ! Heat-Resistant Coating Binder PNVATM GE191 Series

Multi Material Solutions

BATTERY CELL

Online Video Leaflet

POWER MODULE

Online Video Leaflet
 1. English Top
 2. New Technology Insights
 3. High Thermal Conductive and Moisture Resistance AlN Filler


NEW TECHNOLOGY INSIGHTSHIGH THERMAL CONDUCTIVE AND MOISTURE RESISTANCE ALN
FILLER

Our brand-new Aluminum Nitride (AlN) filler has been successfully developed in
the market in addition to our existing product portfolios of Aluminum Oxide
(Al2O3) and Boron Nitride (BN) fillers. We also offer fillers that have
excellent insulation reliability. The higher thermal conductivity helps
customers for downsizing and weight reduction of power modules.


NEW ALN FILLER HAS EXCELLENT MOISTURE RESISTANCE

AlN has high thermal conductivity while it is easily decomposed by moisture and
generates corrosive NH3 gas. We have developed new AlN filler with excellent
moisture resistance by applying original thin-layer surface treatment that
prevents the chemical reaction with moisture, and it maintains its original high
thermal conductivity. Our AlN filler contributes to reliability and longer life
of power module with only a few of NH3 generation by 1/10,000. The higher
thermal conductivity helps customers for downsizing and weight reduction of
power module.


BASIC PROPERTIES

 * Excellent thermal conductivity
 * Improvement of moisture resistance

Ceramics thermal conductivity
Thermal conductivity of AlN is 6 times greater than that of Al2O3  Al2O3BN
(h-BN)AlN Thermal conductivity
[W/(m・K)] 36 60 200

The data shown above are representative figures. They are not guaranteed values.

NH3 concentration measurement is SDK original method
Data represents experimental results and does not guarantee specific performance
levels under actual usage.
 * Download the Technical Article,High Thermal Conductive and moisture
   resistance AlN Filler


ALN FILLER PRODUCT LINE-UP


POWDER PROPERTY

Our AlN family wth excellent moisture resistance Particle size (D50) (μm) 2 13
33 44 72 BET Specific surface area (m2/g) 2.4 0.5 0.12 0.08 0.06 Moisture
resistance (NH3 concentration) (mg/L) 2 1 4 2 3

NH3 concentration measurement is SDK original method
The data shown above are representative figures. They are not guaranteed values.


SILICONE SHEET PROPERTY

Flexible and high thermal conductive silicone sheet with AlN  Sheet
propertyMeasurement method Sheet thickness (mm) 2 Dial Gauge Hardness (Asker C)
23 JIS K7312 Hardness (Shore00) 57 ASTM D2240 Thermal conductivity [W/(m・K)] 12
ISO22007-2

The data shown above are representative figures. They are not guaranteed values.


EPOXY SHEET PROPERTY

High thermal conductive and insulating epoxy sheet with AlN  Sheet
PropertyMeasurement Method Sheet thickness (μm) 180 Dial Gauge Thermal
Conductivity[W/(m・K)] 15 ISO18755

The data shown above are representative figures. They are not guaranteed values.


THERMAL CONDUCTIVITY DIFFERENCE AFTER PCT (PRESSURE COOKER TEST/121℃、2ATM) FOR
EPOXY SHEETS

The data shown above are representative figures. They are not guaranteed values.


SDK THERMAL CONDUCTIVE FILLER MATERIALS LINE-UP

We have a rich product portfolios consisting of Al2O3, BN and AlN for insulated
thermal interface materials. We can also offer fillers that has excellent
insulation reliability, enhanced by reduction of voids in Thermal Interface
Materials (TIM) composite with filler-blending technology and surface treatment.
We can provide customers with our customization service, improving compound
viscosity, voltage resistance and thermal conductivity meeting at various levels
of customer’s requirement.

★Please see below for the details of Al2O3, BN filler ;
https://www.sdk.co.jp/english/products/140/145.html

Powder property  Al2O3BN (h-BN)High moisture resistance AlN Grade number 27 4 5
Thermal conductivity of ceramics
[W/(m・K)] 36 60 200 Fillability into resin High Low High

The data shown above are representative figures. They are not guaranteed values.




Download the Technical Article, AlN filler
(Here for measurement results)


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