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Home > News & Analysis > NXP embraces EU’s IPCEI ME/CT to expand R&D
News & Analysis


NXP EMBRACES EU’S IPCEI ME/CT TO EXPAND R&D

19th September 2023
NXP Semiconductors Netherlands B.V.
Sheryl Miles
0 0

NXP Semiconductors has announced it is strengthening its European research and
development (R&D) through grants to be provided via the 2nd Important Project of
Common European Interest on Microelectronics and Communication Technologies
(IPCEI ME/CT), with the final investment decision pending confirmation of the
level of public funding.

Dedicated NXP teams across Austria, Germany, the Netherlands, and Romania will
innovate in core technologies across automotive, industrial, and cybersecurity.
This includes 5nm, advanced driving assistance and battery management systems in
automotive, 6G, and Ultra-Wideband as well as artificial intelligence (AI),
RISC-V, and post-quantum cryptography.



“NXP’s planned investments in our Austrian, German, Dutch, and Romanian
operations signal our strong commitment to the EU’s goal of enabling both
digital and green transition,” said Kurt Sievers, President and CEO of NXP. “Our
activities through IPCEI ME/CT complement NXP’s planned joint venture
participation in TSMC’s first European foundry. It also underscores our
commitment to strengthening innovation and supply chain resilience in Europe.
NXP believes expanding research, development, and manufacturing efforts in
Europe is of vital importance, and each of these three critical elements must be
successfully integrated to achieve greater European semiconductor ecosystem
resilience.”

Extensive research, development, and manufacturing presence across multiple
sites in all four countries enable NXP to develop cutting-edge technology and
products that contribute significantly to the achievement of EU industrial
strategies. In close collaboration with a strong ecosystem of more than 50
partners from industry and academia across Europe, NXP will strengthen key
technologies of microelectronics in Europe.

No other microelectronics company participating in IPCEI ME/CT is currently
planning to invest in its operations across so many EU member states. NXP is
also an active participant in three of the four IPCEI ME/CT workstreams:
‘Sense’, ‘Think’, and ‘Communicate’, reflecting NXP’s areas of leadership and
strategic focus.

NXP’s planned investments in Austria, Germany, the Netherlands, and Romania
follow the announcement that the company is going to form a new joint venture,
ESMC (European Semiconductor Manufacturing Company), with TSMC, Bosch, and
Infineon with plans to establish TSMC’s first semiconductor manufacturing site
in Europe. The new 300mm fab, planned to be built in Dresden, Germany, is
expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers
on TSMC’s 28/22 nanometre planar CMOS and 16/12 nanometre FinFET process
technology, further strengthening Europe’s semiconductor manufacturing ecosystem
with advanced FinFET transistor technology and creating about 2,000 direct
high-tech professional jobs.



 
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