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Thermal Management in Silicon Carbide (SiC) Designs A game-changer for IP designers: design-stage verification Login Register Contact Us * Home * News * Tech Room * Automotive * Design Automation * Amplifiers/Converters * Manufacturing * Communications * Energy * Sensors * RFICs * Industrial Automation * Embedded Systems * FPGAs/PLDs * Memory ICs * Optoelectronics * Processors/Controllers * Test & Measurement * Wireless and Networking * New Products * In Focus * Downloads * eBook * Webinars * Events Calendar * Videos * PowerUP2024 * Virtual Events * PowerUP2024 * EAC 2023 * EAC 2022 * PowerUP 2023 * Mogelijk gemaakt door Translate X Top Stories GaN/SiC 2024-04-23- Oxford Instruments SIC SUBSTRATES: PLASMA POLISH REMOVES SUBSURFACE DAMAGE Wireless and Networking 2024-04-23- Silicon Labs “APAC TECH TALKS 2024” WIRELESS TECHNOLOGY TRAININGS HELP DEVELOPERS TO ENABLE IOT INNOVATIONS TO NEXT LEVEL FPGAs/PLDs 2024-04-22- Ansgar Hein STANDARDIZING INTERFACES TO MAKE HETEROGENEOUS FPGAS INTERCHANGEABLE Test & Measurement 2024-04-18- Keysight Technologies WHY CHIPLETS NEED A “BEYOND IP” MANAGEMENT APPROACH Display 2024-04-30- Pierre Laboisse WILL MICROLEDS REVOLUTIONIZE OUR SCREENS? Sustainability 2024-04-29- Steve Santamaria BALANCING TECHNOLOGICAL PROGRESS WITH ENVIRONMENTAL STEWARDSHIP Electric Vehicles 2024-04-25- Hwee Yng Yeo, Keysight Technologies EV BATTERY DESIGN – INNOVATING FOR LONGER RANGE AND BATTERY LIFE Memory 2024-04-24- Gary Hilson AI-DRIVEN HBM UPTAKE IS POWER-SENSITIVE GaN/SiC 2024-04-23- Oxford Instruments SIC SUBSTRATES: PLASMA POLISH REMOVES SUBSURFACE DAMAGE Wireless and Networking 2024-04-23- Silicon Labs “APAC TECH TALKS 2024” WIRELESS TECHNOLOGY TRAININGS HELP DEVELOPERS TO ENABLE IOT INNOVATIONS TO NEXT LEVEL FPGAs/PLDs 2024-04-22- Ansgar Hein STANDARDIZING INTERFACES TO MAKE HETEROGENEOUS FPGAS INTERCHANGEABLE Test & Measurement 2024-04-18- Keysight Technologies WHY CHIPLETS NEED A “BEYOND IP” MANAGEMENT APPROACH Display 2024-04-30- Pierre Laboisse WILL MICROLEDS REVOLUTIONIZE OUR SCREENS? Sustainability 2024-04-29- Steve Santamaria BALANCING TECHNOLOGICAL PROGRESS WITH ENVIRONMENTAL STEWARDSHIP Electric Vehicles 2024-04-25- Hwee Yng Yeo, Keysight Technologies EV BATTERY DESIGN – INNOVATING FOR LONGER RANGE AND BATTERY LIFE Memory 2024-04-24- Gary Hilson AI-DRIVEN HBM UPTAKE IS POWER-SENSITIVE Recommended EDA SYNOPSYS ACCELERATES NEXT-LEVEL CHIP INNOVATION ON TSMC ADVANCED PROCESSES Market News TRENDFORCE: NVIDIA’S BLACKWELL EXPECTED TO BOOST TSMC’S COWOS TOTAL CAPACITY BY OVER 150% IN 2024 Automotive SK KEYFOUNDRY NOW OFFERS ENHANCED 0.13ΜM BCD PROCESS EDA ANSYS AND TSMC PARTNER TO ENABLE MULTIPHYSICS PLATFORM FOR OPTICS AND PHOTONICS Market News OMDIA: 2024 SEES STRONG RECOVERY IN LARGE-AREA DISPLAY MARKET Test & Measurement TEKTRONIX SIGNALVU V5.4 HANDLES UP TO EIGHT SIMULTANEOUS SIGNALS EDA SYNOPSYS ACCELERATES NEXT-LEVEL CHIP INNOVATION ON TSMC ADVANCED PROCESSES Market News TRENDFORCE: NVIDIA’S BLACKWELL EXPECTED TO BOOST TSMC’S COWOS TOTAL CAPACITY BY OVER 150% IN 2024 Automotive SK KEYFOUNDRY NOW OFFERS ENHANCED 0.13ΜM BCD PROCESS EDA ANSYS AND TSMC PARTNER TO ENABLE MULTIPHYSICS PLATFORM FOR OPTICS AND PHOTONICS Market News OMDIA: 2024 SEES STRONG RECOVERY IN LARGE-AREA DISPLAY MARKET Test & Measurement TEKTRONIX SIGNALVU V5.4 HANDLES UP TO EIGHT SIMULTANEOUS SIGNALS EDA SYNOPSYS ACCELERATES NEXT-LEVEL CHIP INNOVATION ON TSMC ADVANCED PROCESSES Market News TRENDFORCE: NVIDIA’S BLACKWELL EXPECTED TO BOOST TSMC’S COWOS TOTAL CAPACITY BY OVER 150% IN 2024 Automotive SK KEYFOUNDRY NOW OFFERS ENHANCED 0.13ΜM BCD PROCESS * 1 * 2 * 3 Hot Topic FPGAs/PLDs STANDARDIZING INTERFACES TO MAKE HETEROGENEOUS FPGAS INTERCHANGEABLE 2024/1/19-4/19 Online Webinar Watch Now 2024/4/17-5/16 Whitepaper Download Now 2024/3/19-2024/6/19 Online Webinar Watch Now 2024/2/20-5/20 Online Webinar Watch Now 2024/1/19-4/19 Online Webinar Watch Now 2024/4/17-5/16 Whitepaper Download Now 2024/3/19-2024/6/19 Online Webinar Watch Now 2024/2/20-5/20 Online Webinar Watch Now 2024/1/19-4/19 Online Webinar Watch Now 2024/4/17-5/16 Whitepaper Download Now 2024/3/19-2024/6/19 Online Webinar Watch Now 2024/2/20-5/20 Online Webinar Watch Now EDITOR'S CHOICE Smart Cities SHOWCASING TAIWAN’S SMART CITY INITIATIVES Smart Cities TAIWAN’S NET-ZERO EFFORTS ON SPOTLIGHT AT 11TH SCSE Controls/MCUs ST POWERING WIDER ADOPTION AND IMPLEMENTATION OF EDGE AI Power Management PCIM ASIA 2024 TO STRENGTHEN POWER ELECTRONICS TIES ACROSS ASIA Manufacturing WHY BURN-IN IS IMPORTANT IN RELIABILITY TESTING Storage FERRISSD OFFERS THE STABILITY AND DATA SECURITY REQUIRED IN MEDICAL EQUIPMENT Embedded Systems EDGE COMPUTING’S QUANTUM LEAP: ADVANTECH HPEC SOLUTION ACCELERATES EDGE EVOLUTION Embedded Systems LIGHT AND SOUND SIGNALLING SYSTEMS 101 Smart Cities 2024 SMART CITY SUMMIT & EXPO: AI IS EVERYWHERE Test & Measurement SHATTERED SILOS: 2024’S TOP TECHNOLOGY TREND Processors/Controllers NEUCHIPS DRIVING AI INNOVATIONS IN INFERENCING Processors/Controllers SEE THE FUTURE AT NVIDIA GTC 2024 Embedded Systems USING A RASPBERRY PI 5 WITH DIGILENT’S WAVEFORMS ENHANCES USER EXPERIENCES Wireless and Networking “APAC TECH TALKS 2024” WIRELESS TECHNOLOGY TRAININGS HELP DEVELOPERS TO ENABLE IOT INNOVATIONS TO NEXT LEVEL FPGAs/PLDs STANDARDIZING INTERFACES TO MAKE HETEROGENEOUS FPGAS INTERCHANGEABLE AI TAIWAN STARTUP INNOVATES NEW-GEN 3D AL ASSISTANT WITH VR/MR TECHNOLOGIES Medical AGAI POWERS TRANSFORMATIVE HEALTHCARE DIGITIZATION Smart Cities MATCHMADE ASIA: COLLABORATING TOWARDS A GREENER, MORE SUSTAINABLE FUTURE Smart Cities SHOWCASING TAIWAN’S SMART CITY INITIATIVES Smart Cities TAIWAN’S NET-ZERO EFFORTS ON SPOTLIGHT AT 11TH SCSE Controls/MCUs ST POWERING WIDER ADOPTION AND IMPLEMENTATION OF EDGE AI Power Management PCIM ASIA 2024 TO STRENGTHEN POWER ELECTRONICS TIES ACROSS ASIA Manufacturing WHY BURN-IN IS IMPORTANT IN RELIABILITY TESTING Storage FERRISSD OFFERS THE STABILITY AND DATA SECURITY REQUIRED IN MEDICAL EQUIPMENT Embedded Systems EDGE COMPUTING’S QUANTUM LEAP: ADVANTECH HPEC SOLUTION ACCELERATES EDGE EVOLUTION Embedded Systems LIGHT AND SOUND SIGNALLING SYSTEMS 101 Smart Cities 2024 SMART CITY SUMMIT & EXPO: AI IS EVERYWHERE Test & Measurement SHATTERED SILOS: 2024’S TOP TECHNOLOGY TREND Processors/Controllers NEUCHIPS DRIVING AI INNOVATIONS IN INFERENCING Processors/Controllers SEE THE FUTURE AT NVIDIA GTC 2024 Embedded Systems USING A RASPBERRY PI 5 WITH DIGILENT’S WAVEFORMS ENHANCES USER EXPERIENCES Wireless and Networking “APAC TECH TALKS 2024” WIRELESS TECHNOLOGY TRAININGS HELP DEVELOPERS TO ENABLE IOT INNOVATIONS TO NEXT LEVEL FPGAs/PLDs STANDARDIZING INTERFACES TO MAKE HETEROGENEOUS FPGAS INTERCHANGEABLE AI TAIWAN STARTUP INNOVATES NEW-GEN 3D AL ASSISTANT WITH VR/MR TECHNOLOGIES Medical AGAI POWERS TRANSFORMATIVE HEALTHCARE DIGITIZATION Smart Cities MATCHMADE ASIA: COLLABORATING TOWARDS A GREENER, MORE SUSTAINABLE FUTURE Smart Cities SHOWCASING TAIWAN’S SMART CITY INITIATIVES Smart Cities TAIWAN’S NET-ZERO EFFORTS ON SPOTLIGHT AT 11TH SCSE Controls/MCUs ST POWERING WIDER ADOPTION AND IMPLEMENTATION OF EDGE AI Power Management PCIM ASIA 2024 TO STRENGTHEN POWER ELECTRONICS TIES ACROSS ASIA Manufacturing WHY BURN-IN IS IMPORTANT IN RELIABILITY TESTING Storage FERRISSD OFFERS THE STABILITY AND DATA SECURITY REQUIRED IN MEDICAL EQUIPMENT ‹› LEARNING STUDIO WEBINARS 2024/04/30 FROM DATA TO DIALOGUE: BUILDING INTELLIGENT AI CHATBOTS USING RETRIEVAL AUGMENTED GENERATION (RAG) REDCAP DEVICE TESTING MADE EASY FUNDAMENTALS OF EMI DEBUGGING & PRECOMPLIANCE MATTER OVER WI-FI AND THREAD – SILICON LABS PCIE 5.0 / 6.0 AND IEEE802.3CK CABLE TEST– SIGNAL INTEGRITY, PERFORMANCE PARAMETERS, AND AUTOMATION DOWNLOADS UNDERSTANDING ERROR VECTOR MAGNITUDE (EVM) TESTING RF POWER AMPLIFIER DESIGNS REDCAP: THE IOT TECHNOLOGY FOR 5G NETWORKS A GAME-CHANGER FOR IP DESIGNERS: DESIGN-STAGE VERIFICATION REDUCE 3DIC DESIGN COMPLEXITY WITH EARLY PACKAGE ASSEMBLY VERIFICATION SPECIAL REPORTS IN FOCUS: OUTLOOK 2024 IN FOCUS: COMPUTEX 2023 IN FOCUS: GAN/SIC DEVELOPMENTS IN FOCUS: AUTOMOTIVE ELECTRONICS IN FOCUS: INDUSTRIAL AUTOMATION SUBSCRIBE TO NEWSLETTER EVENTS CALENDAR MORE + LOOKING FOR DATASHEETS? Latest Posts Most Popular 2024-04-30 ANSYS AND TSMC PARTNER TO ENABLE MULTIPHYSICS PLATFORM FOR OPTICS AND PHOTONICS 2024-04-30 OMDIA: 2024 SEES STRONG RECOVERY IN LARGE-AREA DISPLAY MARKET 2024-04-30 TEKTRONIX SIGNALVU V5.4 HANDLES UP TO EIGHT SIMULTANEOUS SIGNALS 2024-04-24 AI-DRIVEN HBM UPTAKE IS POWER-SENSITIVE 2024-04-15 EXPLORING WIRED NETWORKS FOR SMART PATHWAYS IN FACTORIES 2024-03-11 NEUCHIPS DRIVING AI INNOVATIONS IN INFERENCING 2016-08-25 HAPTIC TECHNOLOGY LETS YOU FEEL THE MUSIC 2019-11-22 IS CHINA’S ‘BIG FUND’ ENOUGH? 2018-11-02 UMC STOPS JOINT FUJIAN JINHUA PROJECT 2019-06-19 RISC-V: NOT JUST AN ACADEMIC PROJECT 2022-11-02 A SUSTAINABLE FUTURE IS ON THE HORIZON WITH DIGITAL TWINS AND AI LATEST VIDEOS MORE + 2024-04-18 - AIT SEMI:THE LEADING FABLESS ANALOG & MIX-SIGNAL IC DESIGNER 2024-03-19 - DRAGONFLY S USB3 CAMERA 2024-03-18 - Nordic NORDIC: SNEAK PEEK AT NRF54H20 – REVOLUTIONARY NEW MULTIPROTOCOL SOC 2024-04-28 - JET OPTO IS RESHAPING THE FUTURE CABIN EXPERIENCE BY INTEGRATING SENSING TECHNOLOGY WITH THE ICLED SERIES, RANGING FROM SOPHISTICATED CABIN APPLICATIONS TO CREATING IMMERSIVE INTERIOR AMBIANCE 2024-04-26 - UPBEAT TECHNOLOGY LAUNCHES UP201/301 AND UPM01, ADVANCING POWER EFFICIENCY AND NOISE REDUCTION IN WEARABLES AND CONSUMER ELECTRONICS 2024-04-18 - AIT SEMI:THE LEADING FABLESS ANALOG & MIX-SIGNAL IC DESIGNER 2024-03-19 - DRAGONFLY S USB3 CAMERA 2024-03-18 - Nordic NORDIC: SNEAK PEEK AT NRF54H20 – REVOLUTIONARY NEW MULTIPROTOCOL SOC 2024-04-28 - JET OPTO IS RESHAPING THE FUTURE CABIN EXPERIENCE BY INTEGRATING SENSING TECHNOLOGY WITH THE ICLED SERIES, RANGING FROM SOPHISTICATED CABIN APPLICATIONS TO CREATING IMMERSIVE INTERIOR AMBIANCE 2024-04-26 - UPBEAT TECHNOLOGY LAUNCHES UP201/301 AND UPM01, ADVANCING POWER EFFICIENCY AND NOISE REDUCTION IN WEARABLES AND CONSUMER ELECTRONICS 2024-04-18 - AIT SEMI:THE LEADING FABLESS ANALOG & MIX-SIGNAL IC DESIGNER FEATURED DOWNLOADS MORE + CHARTING THE COURSE TO WI-FI 7 EXCELLENCE: UNVEILING THE IEEE 802.11BE STANDARD 2023-12-01 download CHARTING THE COURSE TO WI-FI 7 EXCELLENCE: UNVEILING THE IEEE 802.11BE STANDARD 2023-12-01 download CHARTING THE COURSE TO WI-FI 7 EXCELLENCE: UNVEILING THE IEEE 802.11BE STANDARD 2023-12-01 download CHARTING THE COURSE TO WI-FI 7 EXCELLENCE: UNVEILING THE IEEE 802.11BE STANDARD 2023-12-01 download CHARTING THE COURSE TO WI-FI 7 EXCELLENCE: UNVEILING THE IEEE 802.11BE STANDARD 2023-12-01 download NEW PRODUCTS Controls/MCUs ST WIRELESS MCUS ENABLE ENERGY-EFFICIENT CONNECTIVITY IN SMART BUILDINGS, INDUSTRIAL MONITORING GaN/SiC STMICROELECTRONICS SIC POWER MODULES IN VERSATILE PACKAGE CONFIGURATIONS TARGETED AT AUTOMOTIVE APPLICATIONS Communications MICROCHIP RETIMER ACCELERATES DEVELOPMENT PATH FOR 800G AECS GaN/SiC EPC GAN FETS POWER SHRINK MOTOR DRIVES FOR EBIKES, ROBOTS, AND DRONES EDA CADENCE’S VOLTUS INSIGHTAI AUTOMATICALLY IDENTIFIES AND ADDRESSES EM-IR VIOLATIONS Industrial STMICROELECTRONICS UNVEILS HIGHLY SCALABLE HIGH-CURRENT MOTOR-DRIVE SERIES Controls/MCUs RENESAS RELEASES ARM CORTEX-M85-BASED MCU GaN/SiC POWER INTEGRATIONS LAUNCHES 1.25KV GAN SWITCHER IC Sensors RENESAS LAUNCHES INDUCTION MOTOR POSITION SENSING TECHNOLOGY Amplifiers/Converters STMICROELECTRONICS OP AMPS TARGETED AT INDUSTRIAL AND AUTOMOTIVE SENSOR SIGNAL CONDITIONING Embedded Systems PORTWELL EXPANDS COM EXPRESS MODULE PORTFOLIO Sensors STMICROELECTRONICS GLOBAL-SHUTTER IMAGE SENSOR FEATURES HIGH RESOLUTION IN COMPACT FORM FACTOR Embedded Systems ST LAUNCHES EMBEDDED SOFTWARE FOR SENSORLESS ZERO-SPEED/HIGH-TORQUE MOTOR CONTROL Amplifiers/Converters TELEDYNE E2V EXPANDS PORTFOLIO OF SPACE-QUALIFIED GAN HEMTS Embedded Systems ST SIMPLIFIES DEVELOPMENT OF QI WIRELESS CHARGERS WITH NEW TX/RX EVALUATION BOARDS Embedded Systems MSI ANNOUNCES XEON E-2400-BASED SERVER PLATFORMS Controls/MCUs RENESAS ENABLE FULL TORQUE AT ZERO SPEED IN SENSORLESS BLDC MOTORS Power ICs MICROCHIP PRESS-FIT TERMINAL POWER MODULES ENABLE SOLDER-FREE SOLUTION IN HIGH-VOLUME MANUFACTURING Power Management ST PRECISION DIGITAL POWER MONITOR FEATURES MIPI I3C SUPPORT Passives SCHURTER FUSE TARGETED AT LI-ION BATTERIES Controls/MCUs ST WIRELESS MCUS ENABLE ENERGY-EFFICIENT CONNECTIVITY IN SMART BUILDINGS, INDUSTRIAL MONITORING GaN/SiC STMICROELECTRONICS SIC POWER MODULES IN VERSATILE PACKAGE CONFIGURATIONS TARGETED AT AUTOMOTIVE APPLICATIONS Communications MICROCHIP RETIMER ACCELERATES DEVELOPMENT PATH FOR 800G AECS GaN/SiC EPC GAN FETS POWER SHRINK MOTOR DRIVES FOR EBIKES, ROBOTS, AND DRONES EDA CADENCE’S VOLTUS INSIGHTAI AUTOMATICALLY IDENTIFIES AND ADDRESSES EM-IR VIOLATIONS Industrial STMICROELECTRONICS UNVEILS HIGHLY SCALABLE HIGH-CURRENT MOTOR-DRIVE SERIES Controls/MCUs RENESAS RELEASES ARM CORTEX-M85-BASED MCU GaN/SiC POWER INTEGRATIONS LAUNCHES 1.25KV GAN SWITCHER IC Sensors RENESAS LAUNCHES INDUCTION MOTOR POSITION SENSING TECHNOLOGY Amplifiers/Converters STMICROELECTRONICS OP AMPS TARGETED AT INDUSTRIAL AND AUTOMOTIVE SENSOR SIGNAL CONDITIONING Embedded Systems PORTWELL EXPANDS COM EXPRESS MODULE PORTFOLIO Sensors STMICROELECTRONICS GLOBAL-SHUTTER IMAGE SENSOR FEATURES HIGH RESOLUTION IN COMPACT FORM FACTOR Embedded Systems ST LAUNCHES EMBEDDED SOFTWARE FOR SENSORLESS ZERO-SPEED/HIGH-TORQUE MOTOR CONTROL Amplifiers/Converters TELEDYNE E2V EXPANDS PORTFOLIO OF SPACE-QUALIFIED GAN HEMTS Embedded Systems ST SIMPLIFIES DEVELOPMENT OF QI WIRELESS CHARGERS WITH NEW TX/RX EVALUATION BOARDS Embedded Systems MSI ANNOUNCES XEON E-2400-BASED SERVER PLATFORMS Controls/MCUs RENESAS ENABLE FULL TORQUE AT ZERO SPEED IN SENSORLESS BLDC MOTORS Power ICs MICROCHIP PRESS-FIT TERMINAL POWER MODULES ENABLE SOLDER-FREE SOLUTION IN HIGH-VOLUME MANUFACTURING Power Management ST PRECISION DIGITAL POWER MONITOR FEATURES MIPI I3C SUPPORT Passives SCHURTER FUSE TARGETED AT LI-ION BATTERIES ‹› PEOPLE Embedded Systems IAR SYSTEMS HIGHLIGHTS GROWING EMBEDDED SOFTWARE ECOSYSTEM IN ASEAN IoT ALTAIR’S JIM CANTELE DISCUSSES OPPORTUNITIES IN ASIA People TSMC’S DR. MARK LIU TO RETIRE People VEGARD WOLLAN NAMED NEW CEO OF NORDIC SEMICONDUCTOR People LARS BRICKENKAMP APPOINTED AS NEW CEO OF SCHURTER People MEDIATEK’S RICK TSAI RECEIVES GSA’S HIGHEST HONOR IoT EXCLUSIVE INTERVIEW: MATT JOHNSON ON HOW SILICON LABS IS ENABLING IOT INNOVATIONS People SASSINE GHAZI APPOINTED PRESIDENT AND CEO OF SYNOPSYS Smart Cities MATCHMADE ASIA: COLLABORATING TOWARDS A GREENER, MORE SUSTAINABLE FUTURE Controls/MCUs ST POWERING WIDER ADOPTION AND IMPLEMENTATION OF EDGE AI People SCHURTER APPOINTS GUANGHUA YANG AS NEW HEAD OF ASIA Semiconductor EXCLUSIVE INTERVIEW WITH MA-TEK CEO DR. YONG-FEN HSIEH Embedded Systems IAR SYSTEMS HIGHLIGHTS GROWING EMBEDDED SOFTWARE ECOSYSTEM IN ASEAN IoT ALTAIR’S JIM CANTELE DISCUSSES OPPORTUNITIES IN ASIA People TSMC’S DR. MARK LIU TO RETIRE People VEGARD WOLLAN NAMED NEW CEO OF NORDIC SEMICONDUCTOR People LARS BRICKENKAMP APPOINTED AS NEW CEO OF SCHURTER People MEDIATEK’S RICK TSAI RECEIVES GSA’S HIGHEST HONOR IoT EXCLUSIVE INTERVIEW: MATT JOHNSON ON HOW SILICON LABS IS ENABLING IOT INNOVATIONS People SASSINE GHAZI APPOINTED PRESIDENT AND CEO OF SYNOPSYS Smart Cities MATCHMADE ASIA: COLLABORATING TOWARDS A GREENER, MORE SUSTAINABLE FUTURE Controls/MCUs ST POWERING WIDER ADOPTION AND IMPLEMENTATION OF EDGE AI People SCHURTER APPOINTS GUANGHUA YANG AS NEW HEAD OF ASIA Semiconductor EXCLUSIVE INTERVIEW WITH MA-TEK CEO DR. YONG-FEN HSIEH Embedded Systems IAR SYSTEMS HIGHLIGHTS GROWING EMBEDDED SOFTWARE ECOSYSTEM IN ASEAN IoT ALTAIR’S JIM CANTELE DISCUSSES OPPORTUNITIES IN ASIA People TSMC’S DR. MARK LIU TO RETIRE People VEGARD WOLLAN NAMED NEW CEO OF NORDIC SEMICONDUCTOR ‹› OPINION Chip Shortages CHIP SHORTAGES: LESSONS ON SUPPLY CHAIN RESILIENCY Analog ADI-MAXIM DEAL: WHERE’S ADI HEADED? Automotive AUTONOMOUS VEHICLE: COMPLEX OR COMPLICATED? Automotive BATTERY EVS: NOT IF, BUT WHEN AND HOW FAST Automotive AUTONOMOUS VEHICLES: WHO NEEDS ’EM? In Asia A LOOK AT THE CURRENT PHILIPPINE ELECTRONICS MANUFACTURING LANDSCAPE (PART 2) Automotive BLOG: WILL MERCEDES-NVIDIA DEAL BRING ‘AUTONOMY’? Automotive IT’S TIME TO GET SERIOUS ABOUT DMS Autonomous Vehicles SENSORS: HEART OF THE ROBOTIC MOBILITY DISRUPTION Foundry BLOG: POLITICS HAUNTS TSMC’S US FAB PLAN 5G COVID-19 CASTS CLOUDS OVER CHIP FORECASTS In Asia A LOOK AT THE CURRENT PHILIPPINE ELECTRONICS MANUFACTURING LANDSCAPE (PART 1) Power I CAN GRASP KILOWATTS, BUT NOT KILOAMPS MAKING SENSE OF THE VEHICLE AUTOMATION LEVELS Automotive A LOOK INTO DIFFERENT DMS DESIGN WINS Semiconductor REIMAGINING THE SEMICONDUCTOR SUPPLY CHAIN TO PREVENT THE NEXT CHIP SHORTAGE Wireless WITHOUT INTELLIGENT MANAGEMENT AND OPTIMIZATION, POTENTIAL OF WIFI 6 IS LIMITED Automotive DMS BECOMING A ‘MUST-HAVE’ FOR MOST OEMS Chip Shortages CHIP SHORTAGES: LESSONS ON SUPPLY CHAIN RESILIENCY Analog ADI-MAXIM DEAL: WHERE’S ADI HEADED? Automotive AUTONOMOUS VEHICLE: COMPLEX OR COMPLICATED? Automotive BATTERY EVS: NOT IF, BUT WHEN AND HOW FAST Automotive AUTONOMOUS VEHICLES: WHO NEEDS ’EM? In Asia A LOOK AT THE CURRENT PHILIPPINE ELECTRONICS MANUFACTURING LANDSCAPE (PART 2) Automotive BLOG: WILL MERCEDES-NVIDIA DEAL BRING ‘AUTONOMY’? Automotive IT’S TIME TO GET SERIOUS ABOUT DMS Autonomous Vehicles SENSORS: HEART OF THE ROBOTIC MOBILITY DISRUPTION Foundry BLOG: POLITICS HAUNTS TSMC’S US FAB PLAN 5G COVID-19 CASTS CLOUDS OVER CHIP FORECASTS In Asia A LOOK AT THE CURRENT PHILIPPINE ELECTRONICS MANUFACTURING LANDSCAPE (PART 1) Power I CAN GRASP KILOWATTS, BUT NOT KILOAMPS MAKING SENSE OF THE VEHICLE AUTOMATION LEVELS Automotive A LOOK INTO DIFFERENT DMS DESIGN WINS Semiconductor REIMAGINING THE SEMICONDUCTOR SUPPLY CHAIN TO PREVENT THE NEXT CHIP SHORTAGE Wireless WITHOUT INTELLIGENT MANAGEMENT AND OPTIMIZATION, POTENTIAL OF WIFI 6 IS LIMITED Automotive DMS BECOMING A ‘MUST-HAVE’ FOR MOST OEMS Chip Shortages CHIP SHORTAGES: LESSONS ON SUPPLY CHAIN RESILIENCY Analog ADI-MAXIM DEAL: WHERE’S ADI HEADED? Automotive AUTONOMOUS VEHICLE: COMPLEX OR COMPLICATED? Automotive BATTERY EVS: NOT IF, BUT WHEN AND HOW FAST Automotive AUTONOMOUS VEHICLES: WHO NEEDS ’EM? 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