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<form class="elementor-form" method="post" name="New Form">
<input type="hidden" name="post_id" value="194">
<input type="hidden" name="form_id" value="5747a0b">
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<input type="hidden" name="queried_id" value="194">
<div class="elementor-form-fields-wrapper elementor-labels-above">
<div class="elementor-field-type-text elementor-field-group elementor-column elementor-field-group-name elementor-col-100 elementor-field-required elementor-mark-required">
<input size="1" type="text" name="form_fields[name]" id="form-field-name" class="elementor-field elementor-size-sm elementor-field-textual" placeholder="NAME" required="required" aria-required="true">
</div>
<div class="elementor-field-type-email elementor-field-group elementor-column elementor-field-group-email elementor-col-100 elementor-field-required elementor-mark-required">
<input size="1" type="email" name="form_fields[email]" id="form-field-email" class="elementor-field elementor-size-sm elementor-field-textual" placeholder="EMAIL" required="required" aria-required="true">
</div>
<div class="elementor-field-type-text elementor-field-group elementor-column elementor-field-group-field_3679800 elementor-col-100 elementor-field-required elementor-mark-required">
<input size="1" type="text" name="form_fields[field_3679800]" id="form-field-field_3679800" class="elementor-field elementor-size-sm elementor-field-textual" placeholder="COMPANY" required="required" aria-required="true">
</div>
<div class="elementor-field-type-textarea elementor-field-group elementor-column elementor-field-group-message elementor-col-100 elementor-field-required elementor-mark-required">
<textarea class="elementor-field-textual elementor-field elementor-size-sm" name="form_fields[message]" id="form-field-message" rows="4" placeholder="MESSAGE" required="required" aria-required="true"></textarea>
</div>
<div class="elementor-field-type-acceptance elementor-field-group elementor-column elementor-field-group-field_d838fb4 elementor-col-100 elementor-field-required elementor-mark-required">
<div class="elementor-field-subgroup">
<span class="elementor-field-option">
<input type="checkbox" name="form_fields[field_d838fb4]" id="form-field-field_d838fb4" class="elementor-field elementor-size-sm elementor-acceptance-field" required="required" aria-required="true">
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</div>
</div>
<div class="elementor-field-group elementor-column elementor-field-type-submit elementor-col-30 e-form__buttons">
<button type="submit" class="elementor-button elementor-size-sm">
<span>
<span class=" elementor-button-icon">
</span>
<span class="elementor-button-text">SUBMIT</span>
</span>
</button>
</div>
</div>
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We value your privacy This website or its third-party tools process personal data. You can opt out of the sale of your personal information by clicking on the "Do Not Sell or Share My Personal Information" link. Do Not Sell or Share My Personal Information Opt-out Preferences We use third-party cookies that help us analyze how you use this website, store your preferences, and provide the content and advertisements that are relevant to you. However, you can opt out of these cookies by checking "Do Not Sell or Share My Personal Information" and clicking the "Save My Preferences" button. Once you opt out, you can opt in again at any time by unchecking "Do Not Sell or Share My Personal Information" and clicking the "Save My Preferences" button. Do Not Sell or Share My Personal Information Cancel Save My Preferences Powered by Skip to content * Home * Applications * Advanced Packaging * Secure Chip ID * Rapid Prototyping / High-Mix Production * Photonics * Your Dream * Products * MEBL Platform * Technology * Miniature E-Beam Columns * Parallel, Direct-Write * Digital Writing System * Company * About * Leadership * Careers * Newsroom * Events * Blogs * Contact Us Menu * Home * Applications * Advanced Packaging * Secure Chip ID * Rapid Prototyping / High-Mix Production * Photonics * Your Dream * Products * MEBL Platform * Technology * Miniature E-Beam Columns * Parallel, Direct-Write * Digital Writing System * Company * About * Leadership * Careers * Newsroom * Events * Blogs * Contact Us * Home * Applications * Advanced Packaging * Secure Chip ID * Rapid Prototyping / High-Mix Production * Photonics * Your Dream * Products * MEBL Platform * Technology * Miniature E-Beam Columns * Parallel, Direct-Write * Digital Writing System * Company * About * Leadership * Careers * Newsroom * Events * Blogs * Contact Us Menu * Home * Applications * Advanced Packaging * Secure Chip ID * Rapid Prototyping / High-Mix Production * Photonics * Your Dream * Products * MEBL Platform * Technology * Miniature E-Beam Columns * Parallel, Direct-Write * Digital Writing System * Company * About * Leadership * Careers * Newsroom * Events * Blogs * Contact Us HIGH-PRODUCTIVITY MULTICOLUMN E-BEAM LITHOGRAPHY SYSTEMS WORLD'S FIRST APPLICATIONS Previous Next VIEW MORE PRODUCTS Multicolumn E-Beam Lithography Platform VIEW MORE "THE PAST IS PROLOGUE TO THE FUTURE" PERSONAL NOTE FROM OUR FOUNDER DR. DAVID K. LAM I am grateful for the opportunities to advance chip making technologies in the semiconductor industry. From founding Lam Research in 1980 to develop a single-wafer, cassette-to-cassette, digital-controlled plasma etch system — to now leading development of Multibeam’s MEBL platform to deliver a high-productivity, direct-writing maskless system using multiple miniature e-beam columns — I have never been more excited about revolutionizing the future of semiconductor wafer fabrication. CAREERS NEWSROOM LEADERSHIP COMPANY COMPANY Multibeam leads with a breakthrough Multicolumn E-Beam Lithography solution for cost-effective production of leading-edge semiconductors and rapid time to market. LEARN MORE RECENT NEWS & EVENTS Previous * Mar 19, 2024 MULTIBEAM ACCEPTS 3D INCITES’ ADVANCED TECHNOLOGY ENABLEMENT AWARDS AT IMAPS DPC 2024 Multibeam President Ken MacWilliams attended the IMAPS Device Packaging Conference (DPC) in Arizona and joined fellow our 3D InCites community for the award ceremony. It’s been a great honor to be recognized with the 2024 Advanced Technology Enablement Award. Multibeam is proud to be among leaders in community who are continuously driving new semiconductor manufacturing innovations, especially for advanced packaging applications. The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) direct write solution. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. Multibeam makes it possible to pattern more than 10X larger than current interposers, facilitating wafer-scale integration for processors like HPC, GPUs, and AI engines. With more than 100X DoF improvement over optical lithography, it enables advanced 3D structures and high-resolution interconnects, resulting in a 10x-100x increase in chip-to-chip interconnect bandwidth. Read more * Feb 6, 2024 MULTIBEAM WINS 3D INCITES’ ADVANCED TECHNOLOGY ENABLEMENT AWARDS Multibeam has been selected as a WINNER of the 2024 3D InCites Advanced Technology Enablement Awards! (Check out our “Finalist” feature on pg. 29 of the Yearbook)! We will be at IMAPS DPC in Arizona to accept the award – meet us there! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) solution. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. MEBL makes it possible to pattern more than 10X larger than current interposers, facilitating wafer-scale integration for processors like HPC, GPUs, and AI engines. With more than 100X DoF improvement over optical lithography, it enables advanced 3D structures and high-resolution interconnects, resulting in a 10x-100x increase in chip-to-chip interconnect bandwidth. Read more * Jan 8, 2024 MULTIBEAM SHORTLISTED AS FINALIST FOR 3D INCITES’ ADVANCED TECHNOLOGY ENABLEMENT AWARDS Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! (Check out our feature on pg. 29 of the Yearbook)! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. We’re thrilled to be recognized by such an innovation-forward org for the work we’re doing in this space. Stay tuned! Read more * Jan 1, 2024 MULTIBEAM’S FEATURE IN SEMICONDUCTOR DIGEST MAGAZINE Multibeam Chairman & CEO Dr. David K. Lam shared some insights into what trends and emerging technologies & processes the semiconductor will likely see flourish in 2024. Check out his 2024 Outlook: Executive Viewpoint on page 23 of the November/December 2023 issue! Read more * Apr 24, 2024 SYNOPSYS AND MULTIBEAM ACCELERATE INNOVATION WITH FIRST PRODUCTION-READY E-BEAM LITHOGRAPHY SYSTEM Multibeam’s Multicolumn Electron Beam Lithography (MEBL) Systems are integrated with Synopsys CATS data preparation software, creating an easier and faster path from chip design to production. Using electron beams to produce patterns on silicon wafers, e-beam lithography enables faster yield ramp since there is no need to wait for a mask to be manufactured. Additionally, more efficient cycles of learning are realized given the ability to pattern design iterations across a single wafer. Read more * May 1, 2024 MEMS & SENSORS TECHNICAL CONGRESS – MSTC 2024 Wondering how much further MEMS and Sensors applications can go with Multicolumn E-Beam Lithography technology? Multibeam will be presenting at the 2024 MEMS & Sensors Technical Congress in UCLA hosted by SEMI. Multibeam President Ken MacWilliams will present in Session 4 – MEMS Emerging Technology & Devices, on Limitless MEMS Design Flexibility and Scale: Advanced Multicolumn E-Beam Litho for Rapid Fabrication of High-Resolution Sub-Micron Structures. Meet us there! Los Angeles, CA Read more * Mar 19, 2024 MULTIBEAM ACCEPTS 3D INCITES’ ADVANCED TECHNOLOGY ENABLEMENT AWARDS AT IMAPS DPC 2024 Multibeam President Ken MacWilliams attended the IMAPS Device Packaging Conference (DPC) in Arizona and joined fellow our 3D InCites community for the award ceremony. It’s been a great honor to be recognized with the 2024 Advanced Technology Enablement Award. Multibeam is proud to be among leaders in community who are continuously driving new semiconductor manufacturing innovations, especially for advanced packaging applications. The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) direct write solution. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. Multibeam makes it possible to pattern more than 10X larger than current interposers, facilitating wafer-scale integration for processors like HPC, GPUs, and AI engines. With more than 100X DoF improvement over optical lithography, it enables advanced 3D structures and high-resolution interconnects, resulting in a 10x-100x increase in chip-to-chip interconnect bandwidth. Read more * Feb 6, 2024 MULTIBEAM WINS 3D INCITES’ ADVANCED TECHNOLOGY ENABLEMENT AWARDS Multibeam has been selected as a WINNER of the 2024 3D InCites Advanced Technology Enablement Awards! (Check out our “Finalist” feature on pg. 29 of the Yearbook)! We will be at IMAPS DPC in Arizona to accept the award – meet us there! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) solution. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. MEBL makes it possible to pattern more than 10X larger than current interposers, facilitating wafer-scale integration for processors like HPC, GPUs, and AI engines. With more than 100X DoF improvement over optical lithography, it enables advanced 3D structures and high-resolution interconnects, resulting in a 10x-100x increase in chip-to-chip interconnect bandwidth. Read more * Jan 8, 2024 MULTIBEAM SHORTLISTED AS FINALIST FOR 3D INCITES’ ADVANCED TECHNOLOGY ENABLEMENT AWARDS Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! (Check out our feature on pg. 29 of the Yearbook)! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. We’re thrilled to be recognized by such an innovation-forward org for the work we’re doing in this space. Stay tuned! Read more * Jan 1, 2024 MULTIBEAM’S FEATURE IN SEMICONDUCTOR DIGEST MAGAZINE Multibeam Chairman & CEO Dr. David K. Lam shared some insights into what trends and emerging technologies & processes the semiconductor will likely see flourish in 2024. Check out his 2024 Outlook: Executive Viewpoint on page 23 of the November/December 2023 issue! Read more * Apr 24, 2024 SYNOPSYS AND MULTIBEAM ACCELERATE INNOVATION WITH FIRST PRODUCTION-READY E-BEAM LITHOGRAPHY SYSTEM Multibeam’s Multicolumn Electron Beam Lithography (MEBL) Systems are integrated with Synopsys CATS data preparation software, creating an easier and faster path from chip design to production. Using electron beams to produce patterns on silicon wafers, e-beam lithography enables faster yield ramp since there is no need to wait for a mask to be manufactured. Additionally, more efficient cycles of learning are realized given the ability to pattern design iterations across a single wafer. Read more * May 1, 2024 MEMS & SENSORS TECHNICAL CONGRESS – MSTC 2024 Wondering how much further MEMS and Sensors applications can go with Multicolumn E-Beam Lithography technology? Multibeam will be presenting at the 2024 MEMS & Sensors Technical Congress in UCLA hosted by SEMI. Multibeam President Ken MacWilliams will present in Session 4 – MEMS Emerging Technology & Devices, on Limitless MEMS Design Flexibility and Scale: Advanced Multicolumn E-Beam Litho for Rapid Fabrication of High-Resolution Sub-Micron Structures. Meet us there! Los Angeles, CA Read more * Mar 19, 2024 MULTIBEAM ACCEPTS 3D INCITES’ ADVANCED TECHNOLOGY ENABLEMENT AWARDS AT IMAPS DPC 2024 Multibeam President Ken MacWilliams attended the IMAPS Device Packaging Conference (DPC) in Arizona and joined fellow our 3D InCites community for the award ceremony. It’s been a great honor to be recognized with the 2024 Advanced Technology Enablement Award. Multibeam is proud to be among leaders in community who are continuously driving new semiconductor manufacturing innovations, especially for advanced packaging applications. The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) direct write solution. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. Multibeam makes it possible to pattern more than 10X larger than current interposers, facilitating wafer-scale integration for processors like HPC, GPUs, and AI engines. With more than 100X DoF improvement over optical lithography, it enables advanced 3D structures and high-resolution interconnects, resulting in a 10x-100x increase in chip-to-chip interconnect bandwidth. Read more * Feb 6, 2024 MULTIBEAM WINS 3D INCITES’ ADVANCED TECHNOLOGY ENABLEMENT AWARDS Multibeam has been selected as a WINNER of the 2024 3D InCites Advanced Technology Enablement Awards! (Check out our “Finalist” feature on pg. 29 of the Yearbook)! We will be at IMAPS DPC in Arizona to accept the award – meet us there! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. Multibeam is addressing the slow cycle times of masked-based lithography technologies with its multi-column E-beam lithography (MEBL) solution. This maskless technology enhances multi-die integration with a large write field, high DoF, ultra-fine resolution, and adaptable writing. MEBL makes it possible to pattern more than 10X larger than current interposers, facilitating wafer-scale integration for processors like HPC, GPUs, and AI engines. With more than 100X DoF improvement over optical lithography, it enables advanced 3D structures and high-resolution interconnects, resulting in a 10x-100x increase in chip-to-chip interconnect bandwidth. Read more * Jan 8, 2024 MULTIBEAM SHORTLISTED AS FINALIST FOR 3D INCITES’ ADVANCED TECHNOLOGY ENABLEMENT AWARDS Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! (Check out our feature on pg. 29 of the Yearbook)! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration. We’re thrilled to be recognized by such an innovation-forward org for the work we’re doing in this space. Stay tuned! Read more * Jan 1, 2024 MULTIBEAM’S FEATURE IN SEMICONDUCTOR DIGEST MAGAZINE Multibeam Chairman & CEO Dr. David K. Lam shared some insights into what trends and emerging technologies & processes the semiconductor will likely see flourish in 2024. Check out his 2024 Outlook: Executive Viewpoint on page 23 of the November/December 2023 issue! Read more Next CONTACT US Contact us to learn about our technology and products Multibeam Corporation 3951 Burton Drive Santa Clara, CA 95054, U.S.A. I agree to the Terms and Conditions and Privacy Policy. 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