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GENAI IN CHIP DESIGN

"This solution leverages Synopsys’ leading-edge chip design tools and the
generative AI features from Azure OpenAI Services to tackle complexity and speed
up chip development."

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DRIVING MULTI-DIE INNOVATION

"AMD MI300 leveraged Synopsys IP and EDA suite to create the world's most
advanced multi-die package."

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DELIVERING INNOVATION WITH THE CLOUD

"Pay-per-use licensing has been key to scaling our compute infrastructure,
literally at a push of a few buttons." 

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APPSEC LEADER FOR THE SEVENTH YEAR IN A ROW

Discover why Synopsys continues to be recognized as a Leader among application
security testing vendors evaluated by Gartner


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   GenAI in Chip Design
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   Multi-Die Innovation
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   Innovation with the Cloud
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   2023 Gartner® Magic Quadrant™ for Application Security Testing







EVERYTHING YOU NEED TO ENABLE INNOVATION FROM CHIPS TO SOFTWARE


 

SILICON DESIGN, VERIFICATION & MANUFACTURING

#1 in Electronic Design Automation Solutions & Services

SILICON IP

#1 in Interface, Foundation, & Physical IP

APPLICATION SECURITY

Global Leader in Application Security & Managing Software Risk


LATEST NEWS AND UPDATES


Blog
The Vitality of Change: Congratulations to Sassine Ghazi!



News
Synopsys Announces Sassine Ghazi to Assume President and CEO Role Jan. 1, 2024



News
Wired: “What You're Seeing Here is the 1st of a Real Commercial Processor Design
with AI,” says Aart de Geus



Blog
Synopsys News at Design Automation Conference 2024



News
Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference
Flow for Intel Foundry



News
Synopsys Accelerates Trillion Parameter HPC & AI Supercomputing Chip Designs
with Industry’s First PCIe 7.0 IP Solution



News
Synopsys Posts Financial Results for Second Quarter Fiscal Year 2024



News
Synopsys to Acquire Ansys, Creating a Leader in Silicon to Systems Design
Solutions



News
Sassine Ghazi 2024 Letter to Stakeholders



Blog
The Vitality of Change: Congratulations to Sassine Ghazi!



News
Synopsys Announces Sassine Ghazi to Assume President and CEO Role Jan. 1, 2024



News
Wired: “What You're Seeing Here is the 1st of a Real Commercial Processor Design
with AI,” says Aart de Geus



Blog
Synopsys News at Design Automation Conference 2024



News
Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference
Flow for Intel Foundry



News
Synopsys Accelerates Trillion Parameter HPC & AI Supercomputing Chip Designs
with Industry’s First PCIe 7.0 IP Solution



News
Synopsys Posts Financial Results for Second Quarter Fiscal Year 2024



News
Synopsys to Acquire Ansys, Creating a Leader in Silicon to Systems Design
Solutions



News
Sassine Ghazi 2024 Letter to Stakeholders



Blog
The Vitality of Change: Congratulations to Sassine Ghazi!



News
Synopsys Announces Sassine Ghazi to Assume President and CEO Role Jan. 1, 2024



News
Wired: “What You're Seeing Here is the 1st of a Real Commercial Processor Design
with AI,” says Aart de Geus



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Energy-Efficient SoCs
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software.
Silicon Lifecycle Management
Actionable insights through silicon lifecycle monitoring & analytics.
Multi-Die
System
A comprehensive solution for fast heterogeneous integration.
Design Technology Co-Optimization
Enable efficient evaluation of new transistor architectures & materials.
DevSecOps
Shift security left without slowing down your development teams.
Software Supply Chain Security
Identify & manage software supply chain risks end-to-end.

MADE IN THE CLOUD!

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REQUIREMENTS FOR MULTI-DIE SYSTEM SUCCESS

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2023 GARTNER® MAGIC QUADRANT™ FOR APPLICATION SECURITY TESTING

A Leader for the 7th year in a row

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EXPAND YOUR EXPERTISE

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WHAT WE’RE ABOUT

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OUR COMMITMENT

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